Ceva

Hsinchu County – November 01, 2026 -- Ceva, Inc. (NASDAQ: CEVA) retained the top spot in wireless interface IP with 68% market share by IP revenue, 12 times that of the next-largest vendor, according to IPnest's September 2026 Design IP report. The category grew approximately 14% in 2025.

Ceva's share has held at 67-68% across three IPnest reports

IPnest's earlier reports showed Ceva at 67% for 2023 and 68% for 2024. Ceva estimates its wireless connectivity IP is used in approximately 30% of the world's Bluetooth-enabled IoT devices and 15% of Wi-Fi-enabled IoT devices shipped annually.

Ceva-Waves licenses five wireless standards to chipmakers and OEMs

The Ceva-Waves portfolio covers Bluetooth, Wi-Fi, UWB, 802.15.4 and cellular IoT. Ceva's Bluetooth IP has more than 100 licensees and its Wi-Fi IP more than 60. More than 30 customers have adopted both.

ROCKVILLE – – November 01, 2026 -- Ceva (NASDAQ: CEVA) has secured the first production deployment of its NeuPro NPU family, with Seoul-based Mobilint integrating the NeuPro-Nano NPN32 NPU and SensPro AI DSP into its REGULUS edge AI system-on-chip (SoC).

REGULUS delivers 10 TOPS at under 3W with up to 8GB of memory

REGULUS is a standalone processor for on-device AI. It targets power- and space-constrained applications including robotics, drones, machine vision, smart cameras and IoT devices.

Multi-engine design splits sensing and inference workloads

SensPro handles programmable sensing and signal-processing workloads. NeuPro-Nano handles always-on neural inference. Both sit alongside Mobilint's proprietary AI processing architecture, so each workload runs on the engine best suited to it.

Rockville – October 29, 2026 -- Ceva (NASDAQ: CEVA) has unveiled a next-generation NeuPro NPU portfolio that delivers up to 2X higher AI throughput per mm2 and 50% better energy efficiency than the first generation, and extends the company's neural processing IP into cloud and data center silicon for the first time.

Four NPUs share one architecture and one SDK

The portfolio comprises NeuPro Nano, Prime, Max and Ultra, all built on a common core architecture and a single unified software development kit. Chip designers can move between cores as requirements change, or combine several within one SoC and assign each workload to the best-suited engine. Ceva says this preserves software investment across product generations.