Draper Breaks Ground on $111,000 Sq Ft Microelectronics Hub in Lowell
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Lowell – October 06, 2026 -- Draper has broken ground on a 111,000-square-foot microelectronics facility in Lowell, Massachusetts, designed to onshore advanced chip packaging capacity that is currently 97% dependent on foreign production.
Draper's IMPACT Center targets a critical gap in U.S. chip packaging capacity
Colleen Anderson, Electronic Systems program director at Draper, said only 3 percent of chip packaging is performed in the United States today, leaving a domestic void the new Integrated Microelectronics Production & Advanced Chip Technology (IMPACT) Center intends to fill. The facility will house design, production, and packaging operations covering microelectronics through advanced precision navigation and timing systems, supporting high-mix, low-volume manufacturing for Draper's customer base.