E&R Engineering Opens Malaysia Plant to Meet Chip Packaging Demand
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Kaohsiung – October 04, 2026 -- E&R Engineering Corp. (TWSE: 8027) will open its new Malaysian subsidiary, E&R Semiconductor (Malaysia) Sdn. Bhd., on October 13 in the Melaka Free Trade Zone, adding dedicated Southeast Asian capacity for its packaging materials business.
Melaka facility targets early 2027 mass production of carrier tapes
The plant, located in Phase III of the Batu Berendam Free Trade Zone, is currently running sample testing and qualification, with mass production of Embossed Carrier Tapes and Cover Tapes scheduled to start early next year. E&R said the site will create 50 local jobs and serve as a regional hub for semiconductor and OSAT customers.