KLC Pitches TTV Thermal Testing for AI Chips, 12,000 W EV Heaters
TAICHUNG – October 30, 2026 -- Taiwan King Lung Chin PTC Co., Ltd. (KLC Corporation) is promoting Thermal Test Vehicle (TTV) solutions for AI and high-performance computing (HPC) chip-wafer validation, alongside high-voltage coolant heaters for electric vehicles rated up to 12,000 W.
TTV units simulate thermal loads for cold plate and liquid cooling tests
KLC's TTV solutions provide controllable heat sources that replicate thermal loads in high-power electronic devices and advanced semiconductor architectures. Engineers can use them for early-stage chip-wafer layout and architecture verification, and to evaluate cooling performance in cold plates and liquid cooling systems.
The company cites rising power densities in AI infrastructure and HPC systems as the driver of demand for thermal validation. Target applications include AI servers, GPU platforms, advanced packaging and semiconductor wafer devices.