Taipei – September 16, 2026 -- The 2026 Taiwan Innotech Expo (TIE) will open its doors September 17-19 at Taipei World Trade Center Hall 1, gathering 435 exhibitors from 18 countries to present 1,039 technologies under the theme "AI-Powered Innovation | Driving a Sustainable Future."
Twelve government agencies co-organize the three-day event
The expo is jointly organized by 12 government bodies, including the Ministry of Economic Affairs, National Science and Technology Council, Ministry of Agriculture, Ministry of National Defense, Ministry of Education, Ministry of Labor, Ministry of Health and Welfare, Ministry of Environment, Ministry of Digital Affairs, National Development Council, Academia Sinica, and Ministry of Sports.
Four pavilions structure the exhibition floor
TIE 2026 is organized into the Innovation Economy Pavilion, Future Tech Pavilion (FUTEX), Smart Sustainability Pavilion, and an Invention Competition Area, spanning sectors from semiconductors and manufacturing to healthcare, agriculture, communications, and public services.
AI applications cut across industrial and public-sector use cases
Exhibitors will demonstrate AI integration in semiconductor design, industrial manufacturing, healthcare diagnostics, agricultural technology, telecommunications, and government service delivery, reflecting AI's expanding footprint across both industrial transformation and daily operations.
Matchmaking forum links international capital with Taiwanese tech teams
The Taiwan AI Nexus 2026 Global Forum and Technology Matchmaking Conference will run alongside the expo, connecting international companies and venture capital firms with Taiwanese technology developers for partnership talks and commercialization deals.
Dedicated consultation area targets IP transfer and patent deals
An IP and Technology Trading Consultation Area will offer professional guidance on technology transfer, patent licensing, and venture capital engagement, supported by themed guided tours designed to help visiting companies identify relevant technologies and potential partners.