Longsys to Debut Industrial-Grade SiP mSSD at electronica 2026
MUNICH – November 03, 2026 -- Longsys (301308.SZ/09976.HK) will unveil its first industrial-grade, wide-temperature mSSD at electronica 2026, running November 10-13 in Munich, as demand for storage built for edge AI grows in automotive and industrial applications.
SiP design removes SMT assembly and solder-joint failure risk
The mSSD is built on system-in-package (SiP) technology and integrates the controller, flash memory and passive components into a single package. That eliminates surface-mount technology (SMT) assembly, cutting material use and manufacturing process requirements. Without the solder joints of conventional PCB assembly, the design also removes the associated risk of solder-joint failures. Longsys cites water resistance, dust protection and shock resistance as the basis for its industrial-grade reliability.