Manz Asia, SUSS Partner to Scale Inkjet Tech for Chip Packaging
Taoyuan – September 07, 2026 -- Manz Asia and SUSS have entered a strategic collaboration to accelerate inkjet printing technology for advanced semiconductor packaging, targeting a shift from lab-scale development to high-volume manufacturing.
Manz Asia brings inkjet expertise while SUSS contributes semiconductor process depth
The partnership pairs Manz Asia's proven inkjet capabilities, manufacturing engineering and position in the panel-level packaging ecosystem with SUSS' semiconductor process expertise and global customer reach. Manz Asia's end-to-end inkjet development platform spans material and substrate preparation, printing, curing and process characterization under a Lab-to-Fab approach.