Taoyuan – September 07, 2026 -- Manz Asia and SUSS have entered a strategic collaboration to accelerate inkjet printing technology for advanced semiconductor packaging, targeting a shift from lab-scale development to high-volume manufacturing.
Manz Asia brings inkjet expertise while SUSS contributes semiconductor process depth
The partnership pairs Manz Asia's proven inkjet capabilities, manufacturing engineering and position in the panel-level packaging ecosystem with SUSS' semiconductor process expertise and global customer reach. Manz Asia's end-to-end inkjet development platform spans material and substrate preparation, printing, curing and process characterization under a Lab-to-Fab approach.
Inkjet printing targets material efficiency gains over conventional coating methods
Inkjet technology enables precise, selective material deposition, reducing material consumption and simplifying process flows compared with conventional coating approaches. The companies will jointly explore new inkjet applications, validate materials and processes, and develop scalable manufacturing methods for advanced and panel-level packaging.
SUSS CEO ties deal to Ambition 2030 growth strategy in packaging
"By combining SUSS' semiconductor process experience with Manz Asia's inkjet expertise, we can accelerate technology development and reduce time-to-market for future solutions," said Burkhardt Frick, CEO of SUSS. He said the collaboration strengthens access to the panel-level packaging ecosystem and supports SUSS' Ambition 2030 strategy by expanding its advanced-packaging capabilities and exposure to semiconductor growth markets.
Robert Lin, CEO of Manz Asia, said panel-level packaging is entering a new phase driven by higher integration and increasingly complex structures, creating demand for greater process flexibility and manufacturing scalability.
SUSS generates roughly €500 million in sales with 1,500 employees globally
SUSS, headquartered in Garching, Germany, employs approximately 1,500 people worldwide and recently reported sales of roughly €500 million. The company operates production sites in Germany and Taiwan, with development centers across Europe, Asia and the US. SUSS MicroTec SE is listed on the Frankfurt Stock Exchange under ticker SMHN and is included in the TecDAX and MDAX indices.
Manz Asia's technology base covers electrochemical deposition, wet chemistry, digital printing, automation and software integration, with applications spanning fan-out panel-level packaging (FOPLP), chip-on-panel-on-substrate (CoPoS) and IC substrate processing on glass and organic cores.