Spirox Unveils SP7000G to Speed Glass Substrate Crack Inspection
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Hsinchu – September 10, 2026 -- Spirox Corporation (TWSE: 3055) has launched the SP7000G High-Speed TGV Crack Inspection System, a tool capable of scanning a full 510 mm x 515 mm glass substrate panel in under 20 minutes to detect internal microcracks in high-volume Glass Core and Through Glass Via (TGV) manufacturing.
New system targets microcrack detection after critical build-up processes
The SP7000G is designed to identify internal microcracks that emerge after metallization and Ajinomoto Build-up Film (ABF) processes, key stages in advanced packaging production. Spirox positions the system to improve inspection efficiency, monitor process quality and defect distribution, and optimize manufacturing yield as TGV technology scales toward high-volume output.