Hsinchu – September 10, 2026 -- Spirox Corporation (TWSE: 3055) has launched the SP7000G High-Speed TGV Crack Inspection System, a tool capable of scanning a full 510 mm x 515 mm glass substrate panel in under 20 minutes to detect internal microcracks in high-volume Glass Core and Through Glass Via (TGV) manufacturing.
New system targets microcrack detection after critical build-up processes
The SP7000G is designed to identify internal microcracks that emerge after metallization and Ajinomoto Build-up Film (ABF) processes, key stages in advanced packaging production. Spirox positions the system to improve inspection efficiency, monitor process quality and defect distribution, and optimize manufacturing yield as TGV technology scales toward high-volume output.
Paul Yang of Spirox Corporation said the SP7000G complements the company's existing SP8000G system, together forming what Spirox describes as a comprehensive solution spanning R&D, quality control, and high-volume manufacturing for TGV inspection and analysis.
Corning and DNP executives cite reliability demands from AI and HPC packaging
The product was unveiled at Spirox's Advanced Packaging Technology Forum, which convened industry experts from Corning and Dai Nippon Printing (DNP) to discuss Glass Core, TGV, reliability, and inspection technologies for next-generation AI and high-performance computing (HPC) applications.
Odessa Petzold of Corning said Spirox's laser tomography scanning technology offers a non-destructive method for detecting defects within glass structures, calling it a valuable tool for advanced packaging processes such as TGV that could help accelerate the industry's transition to high-volume manufacturing.
Satoru Kuramochi of DNP said reliability and failure analysis will grow in importance as Glass Core technologies scale for large AI data server packages, noting that non-destructive inspection tools are expected to play a central role in identifying defects across different stages of the manufacturing process.
Glass Core and TGV technologies are gaining traction as AI, HPC, and high-bandwidth memory (HBM) applications drive demand for higher-performance, higher-density packaging architectures.