London – October 15, 2026 -- The global DDR5 AI server memory market is forecast to grow from USD 2.14 billion in 2025 to USD 6.80 billion by 2035, a 12.25% CAGR, according to a new DC Market Insights report. Servers configured with more than 2 TB of DDR5 host memory are projected to account for USD 4.42 billion of that market by 2035.
AI capacity additions are modeled to rise more than fourfold
The report models annual AI capacity additions rising from 4.2 GW to 17.8 GW, expanding the installed base of memory-intensive accelerator servers. AI servers are adding more host memory per node. Accelerator-rich systems raise the value of capacity, bandwidth and memory-channel count.
256 GB modules entered volume qualification in 2026
The 256 GB DDR5 modules support higher server capacities without a proportional increase in DIMM slot counts. SK hynix validated a 256 GB DDR5 RDIMM on Intel Xeon 6. In May 2026, Micron began sampling a 256 GB DDR5 server module at speeds up to 9,200 MT/s.
In September 2026, Micron reported high-teens DRAM price increases and completed qualification of 8,800 MT/s server RDIMMs.
MRDIMM and CXL emerge alongside conventional RDIMM
In April 2026, JEDEC announced new MRDIMM interface logic standards, with 12,800 MT/s support expected in the next generation. AMD demonstrated EPYC 9006 processors with up to 16 DDR5 channels and MRDIMM support up to 12,800 MT/s. The report says these developments let AI servers add capacity while managing slot-count and signal-integrity constraints.
North America held 50% of 2025 market value
Asia Pacific followed with 28% and Europe with 14%. The Middle East and Africa accounted for 4.5% and Latin America for 3.5%. The report attributes regional differences to hyperscale investment, AI adoption, installed data center capacity, power availability, local supply chains and the timing of new construction or retrofit projects.
Report segments demand by module, capacity, accelerator and buyer
The report segments the market in four ways:
- Module type: standard RDIMM up to 64 GB; high-capacity and 3DS RDIMM at 128 GB and above; MRDIMM; and CXL memory expansion modules.
- Memory capacity per server: up to 1 TB, 1 TB to 2 TB, and above 2 TB.
- Accelerator type: GPU servers, custom ASIC servers and other accelerator servers.
- End user: hyperscale cloud providers, GPU cloud and colocation providers, and enterprise and sovereign AI.
Profiled companies include Samsung Electronics, SK hynix, Micron Technology, Kingston Technology, Nanya Technology, CXMT, Winbond Electronics, SMART Global, Netlist, ADATA Technology, Montage Technology, Rambus, Renesas Electronics, Astera Labs and Microchip Technology. The report was updated on Oct. 12, 2026.