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3D TSV, 2.5D Packaging Market to Reach $21.5B by 2035 on AI Demand

London – October 19, 2026 -- The global 3D through-silicon-via (TSV) and 2.5D packaging market will grow from USD 9.46 billion in 2025 to USD 21.50 billion by 2035, according to Credence Research. That implies a compound annual growth rate of 8.50% for 2026-2035. The figures are the firm's proprietary model estimates, not audited supplier sales totals.

HBM and data centers account for the largest share of spending

High-bandwidth memory (HBM) and other memory made up 46.0% of 2025 application revenue. Data centers and high-performance computing held 55.0% of end-use spending. By technology, 2.5D integration led with 38.0% of 2025 value, and die-to-wafer integration accounted for 48.0%.

DDR5 AI Server Memory Market to Hit $6.80B by 2035 on 256 GB Modules

London – October 15, 2026 -- The global DDR5 AI server memory market is forecast to grow from USD 2.14 billion in 2025 to USD 6.80 billion by 2035, a 12.25% CAGR, according to a new DC Market Insights report. Servers configured with more than 2 TB of DDR5 host memory are projected to account for USD 4.42 billion of that market by 2035.

AI capacity additions are modeled to rise more than fourfold

The report models annual AI capacity additions rising from 4.2 GW to 17.8 GW, expanding the installed base of memory-intensive accelerator servers. AI servers are adding more host memory per node. Accelerator-rich systems raise the value of capacity, bandwidth and memory-channel count.