Minneapolis – September 21, 2026 -- Flexible Circuit Technologies Inc. (FCT) has developed a Liquid Leak Detection Flex Assembly aimed at protecting liquid-cooled AI servers and high-performance computing (HPC) systems from coolant failures.
FCT designs sensor to wrap directly around cooling hardware geometry
The flexible sensing assembly is engineered to fit around cold plates, manifolds, quick disconnects, coolant distribution units (CDUs), and server trays, placing detection points close to potential failure sites. The thin, lightweight profile is built for space-constrained rack and server environments where direct-to-chip liquid cooling is expanding.
Assembly targets multiple monitoring zones across the cooling chain
Customizable elements include sensing patterns, circuit geometry, connector interfaces, and multiple detection zones. Potential monitoring locations span supply and return quick disconnects, GPU and CPU cold plates, coolant lines, manifolds, CDUs, and server trays, allowing OEMs to embed leak sensing directly into equipment instead of relying only on facility-level detection systems.
Executive cites growing infrastructure need for embedded detection
"The rapid growth of liquid-cooled AI infrastructure is creating a new need for thin, compact, highly customized leak-detection solutions," said Ray Cottrell, EVP of Flexible Circuit Technologies. He said the design brings flex-circuit engineering directly into cold plates, manifolds, and server-level cooling assemblies to protect high-value electronics.
FCT targets OEMs, cooling-system makers and data-center suppliers
FCT intends to work with server OEMs and ODMs, liquid-cooling companies, cold-plate manufacturers, thermal-management suppliers, and data-center infrastructure providers to tailor the assembly to specific cooling architectures. The company's engineering team will support concept development, rapid prototyping, design-for-manufacturing, flex circuit fabrication, assembly, and scalable production.