Thermal Management

SAN FRANCISCO – November 06, 2026 -- Diamond Foundry Inc. has produced the first single-crystal diamond measuring 200 millimeters in diameter, a size the company says brings the material to semiconductor wafer scale.

The company unveiled the D200mm crystal alongside a video keynote by CEO Martin Roscheisen at CarbonSemi 2026 in Ningbo, China. Diamond Foundry states the crystal is neither an assembly of smaller diamond pieces nor a polycrystalline wafer. The first crystal is shown as grown and unpolished.

Crystal size has been the main constraint on diamond in electronics

Diamond Foundry says diamond combines the highest thermal conductivity with mechanical strength, electrical insulation and optical properties. Its use in advanced technology has been limited by crystal size. Natural diamond is constrained by geology, and conventional lab-grown diamond has historically been limited to relatively small crystals, according to the company.

COLUMBUS, Ohio – October 31, 2026 -- Vertiv Holdings Co. (NYSE: VRT) has completed its acquisition of King Environmental Services Ltd. (KES), extending its thermal and fluid management services into Europe, the Middle East and Africa (EMEA). Financial terms were not disclosed, and Vertiv does not expect the deal to be material to its financial results.

KES adds fluid management and load testing for liquid-cooled data centers

KES is a Europe-based provider of fluid management, commissioning and load-testing services for high-density, liquid-cooled data centers. Founded in 2002, it is headquartered near Dublin, Ireland, and serves EMEA customers from hubs in North Dublin and Frankfurt.

Its service scope covers design review and feasibility studies, pipework flushing, filtration and water treatment, testing, adjusting and balancing (TAB), data logging and thermography, and large-scale thermal and electrical load testing.

TAICHUNG – October 30, 2026 -- Taiwan King Lung Chin PTC Co., Ltd. (KLC Corporation) is promoting Thermal Test Vehicle (TTV) solutions for AI and high-performance computing (HPC) chip-wafer validation, alongside high-voltage coolant heaters for electric vehicles rated up to 12,000 W.

TTV units simulate thermal loads for cold plate and liquid cooling tests

KLC's TTV solutions provide controllable heat sources that replicate thermal loads in high-power electronic devices and advanced semiconductor architectures. Engineers can use them for early-stage chip-wafer layout and architecture verification, and to evaluate cooling performance in cold plates and liquid cooling systems.

The company cites rising power densities in AI infrastructure and HPC systems as the driver of demand for thermal validation. Target applications include AI servers, GPU platforms, advanced packaging and semiconductor wafer devices.

San Jose – October 15, 2026 -- LITEON Technology (2301) is debuting a 2.6MW Enterprise Cooling Distribution Unit (CDU) and a full 800 VDC power stack for AI factories at the OCP Global Summit 2026, running October 12-15 in San Jose, California.

LITEON debuts 2.6MW CDU from investment partner DCX Liquid Cooling Systems

The Enterprise CDU comes from DCX Liquid Cooling Systems, a strategic investment partner of LITEON. It delivers up to 2.6MW of heat transfer capacity and an approach temperature of 3°C. An N+1 redundant pump design is built in for high-density AI and HPC deployments. The unit also carries a next-generation HMI and an integrated software layer for at-a-glance visibility into key system parameters.

LITEON is also showing an 800 VDC Power Shelf integrated with a Battery Backup Unit (BBU).

San Jose – October 14, 2026 -- UfiSpace is demonstrating a live 102.4Tbps liquid-cooled switch with 64 x 1.6T OSFP ports at OCP Global Summit 2026, aiming to prove thermal feasibility for 1.6T AI fabrics as data centers move toward extreme power densities.

Liquid-cooled Tomahawk 6 platform runs with a cooling distribution unit

The S9331-64HO3L is a 2OU ORv3 platform built on the Broadcom Tomahawk 6 ASIC. It operates with a Cooling Distribution Unit (CDU) to deliver real-time cooling. UfiSpace describes it as a validation-ready, early-access architecture and a proof-of-concept for the thermal and mechanical designs needed for 2027/2028 AI clusters.

Columbus – October 13, 2026 -- Vertiv (NYSE: VRT) has completed its acquisition of ThermoKey S.p.A., adding heat rejection and heat-exchange manufacturing capacity in Europe, the Middle East and Africa (EMEA) as AI factories and high-density data centers drive demand for thermal systems. The release does not disclose financial terms.

ThermoKey adds heat-exchange and dry cooler technology to Vertiv's thermal chain

ThermoKey supplies heat-exchange solutions and dry coolers, and its technology is compatible with low-GWP and natural refrigerants. Vertiv says this complements its existing portfolio and lets customers optimize for performance, site conditions and growth. The company already uses ThermoKey technologies in select thermal solutions.

Tognana, Italy – October 13, 2026 -- Vertiv expects to double chiller production capacity at its Tognana campus near Padua by the end of 2026, as demand for AI and high-density computing infrastructure drives investment in data center cooling.

The NYSE-listed company will also complete a new large-scale testing laboratory in early 2027, adding integrated validation capacity to the site.

New laboratory will test chillers with liquid cooling under extreme loads

The facility will test large-scale chillers and validate how they integrate with liquid cooling systems under high-density load conditions and extreme temperature ranges. Vertiv says the capability lets customers verify thermal performance under expected site conditions. The aim is to deploy increasingly complex cooling systems with greater speed and confidence.

San Jose – October 13, 2026 -- Wiwynn unveiled a 6kW double-sided cold plate that it says cuts power delivery loss by up to 80%, alongside AI rack platforms for NVIDIA and AMD and a co-packaged optics (CPO) rack, at the 2026 OCP Global Summit in San Jose.

Wiwynn joins NVIDIA Vera Rubin NVL72 pilot build program

Wiwynn and Wistron are among the first NVIDIA Pilot Build Partners for the Vera Rubin NVL72 platform, covering engineering validation and design-in. The liquid-cooled, rack-scale system integrates 72 NVIDIA Rubin GPUs and 36 NVIDIA Vera CPUs with 6th-generation NVIDIA NVLink.

Wiwynn is also applying its rack integration and manufacturing capabilities to AMD's Helios rackscale solution, built on the Open Rack Wide (ORW) standard. Helios combines AMD Instinct MI450 Series GPUs, 6th Gen AMD EPYC CPUs, AMD Pensando networking and AMD ROCm software, with configurations tailored to cloud service provider (CSP) requirements.

San Jose, Calif. – – October 06, 2026 -- AEWIN Technologies, a unit of Qisda Group, will unveil a modular DC-MHS server lineup capable of supporting rack densities above 200kW using two-phase direct liquid cooling (2P DLC) technology from subsidiary Arivor at the OCP Global Summit 2026, running October 12–15 at Booth #D9.

New servers run AMD EPYC 9006 CPUs with PCIe Gen6 connectivity

The portfolio is built on AMD EPYC 9006 series server processors paired with PCIe Gen6 connectivity to address rising compute-density requirements in AI data centers. AEWIN positions the lineup to reduce power usage effectiveness (PUE) while extending hardware lifespan under sustained high-load conditions.

Minneapolis – September 22, 2026 -- Flexible Circuit Technologies Inc. (FCT) has developed a Liquid Leak Detection Flex Assembly aimed at protecting liquid-cooled AI servers and high-performance computing (HPC) systems from coolant failures.

FCT designs sensor to wrap directly around cooling hardware geometry

The flexible sensing assembly is engineered to fit around cold plates, manifolds, quick disconnects, coolant distribution units (CDUs), and server trays, placing detection points close to potential failure sites. The thin, lightweight profile is built for space-constrained rack and server environments where direct-to-chip liquid cooling is expanding.