San Jose – October 14, 2026 -- LITEON Technology (2301) is debuting a 2.6MW Enterprise Cooling Distribution Unit (CDU) and a full 800 VDC power stack for AI factories at the OCP Global Summit 2026, running October 12-15 in San Jose, California.
LITEON debuts 2.6MW CDU from investment partner DCX Liquid Cooling Systems
The Enterprise CDU comes from DCX Liquid Cooling Systems, a strategic investment partner of LITEON. It delivers up to 2.6MW of heat transfer capacity and an approach temperature of 3°C. An N+1 redundant pump design is built in for high-density AI and HPC deployments. The unit also carries a next-generation HMI and an integrated software layer for at-a-glance visibility into key system parameters.
LITEON is also showing an 800 VDC Power Shelf integrated with a Battery Backup Unit (BBU).
LITEON pairs a 95kW DC/DC Power Shelf with a 280kW in-rack CDU for Vera Rubin NVL72
For the NVIDIA Vera Rubin NVL72 platform, the company presents an integrated solution built on NVIDIA MGX architecture. It combines a 95kW DC/DC Power Shelf with a 280kW Liquid-to-Liquid (L2L) In-Rack CDU. LITEON says the design combines 800 VDC distribution, energy backup and thermal management to cut transmission losses and heat generation. It also aims to raise power density and free rack space.
John Chang, General Manager of LITEON Cloud Infrastructure Platform and Solution SBG, said data center competitiveness is now measured by tokens per watt rather than compute scale alone.
ORv3 rack combines 180kW Power Shelf with 108kW capacitor backup
For the ORv3 architecture, LITEON shows an AI power rack with a 180kW Power Shelf and a 108kW Capacitor Backup Unit (CBU). Centralized power delivery and supercapacitor backup target dynamic AI workloads. The company says this improves power stability and system reliability.
Cooling modules include 120kW and 220kW In-Rack CDUs. These can be combined with Direct-to-Chip architectures to enable higher GPU density.
LITEON covers each power stage from 800 VDC distribution to the GPU
The Grid-to-Chip portfolio spans 800V Power Bricks, IBC Modules, 50V Power Bricks and Voltage Regulator Modules (VRM).
- The 800V DC/DC power brick deploys on the HVDC power distribution board for downstream step-down conversion. Multiple bricks can be paralleled, with active current sharing to improve stability.
- The intermediate bus converter performs the next conversion stage. LITEON says it raises efficiency, reduces distribution losses and optimizes board area and system cost.
- The VRM delivers a stable operating voltage to the GPU, completing the "last mile" from rack to chip.
LITEON is exhibiting at Booth C51, Hall 2, San Jose McEnery Convention Center.