LITEON Technology

Munich – November 06, 2026 -- LITEON Technology will present an end-to-end power architecture built around 800 VDC for AI data centers at electronica 2026 in Munich, running November 10 to 13 across two booths under the theme "LITEON Powers AI."

LITEON covers rack-to-chip power delivery for high-density AI computing

Rising AI power density is reshaping data center power architectures and increasing the need for efficient, reliable power delivery from the rack to the chip. LITEON's architecture spans energy storage, rack-level power delivery, server power and chip-level power conversion.

The product lineup includes 800 VDC, high-power Power Shelves, modular power solutions, 800V and 50V Power Bricks, Intermediate Bus Converter (IBC) Modules and Voltage Regulator Modules (VRMs). LITEON will also show high-power magnetic components for AI power systems, energy storage and industrial power conversion.

San Jose – October 16, 2026 -- LITEON Technology (2301.tw) demonstrated 800 VDC rack power architectures scaling from 330kW to 1.2MW at the 2026 OCP Global Summit, targeting the megawatt-scale AI data centers its partner NVIDIA is building around.

LITEON exhibits 800 VDC Power Rack and 800V-to-50V Power Brick in NVIDIA MGX area

The company was invited to the NVIDIA MGX Ecosystem Ceremony at the summit. It was represented by John Chang, General Manager of its Cloud Infrastructure Platform and Solution SBG; Bob Weng, General Manager of the AIDC Platform SBU; and Simon Ong, President of LITEON USA.

In the MGX exhibit area, LITEON showed its NVIDIA 800 VDC Power Rack and 800V-to-50V Power Brick. The products span rack-level power architecture to power conversion, and are designed for the efficiency, power density and scalability requirements of AI data centers.

San Jose – October 15, 2026 -- LITEON Technology (2301) is debuting a 2.6MW Enterprise Cooling Distribution Unit (CDU) and a full 800 VDC power stack for AI factories at the OCP Global Summit 2026, running October 12-15 in San Jose, California.

LITEON debuts 2.6MW CDU from investment partner DCX Liquid Cooling Systems

The Enterprise CDU comes from DCX Liquid Cooling Systems, a strategic investment partner of LITEON. It delivers up to 2.6MW of heat transfer capacity and an approach temperature of 3°C. An N+1 redundant pump design is built in for high-density AI and HPC deployments. The unit also carries a next-generation HMI and an integrated software layer for at-a-glance visibility into key system parameters.

LITEON is also showing an 800 VDC Power Shelf integrated with a Battery Backup Unit (BBU).

Taipei – September 08, 2026 -- LITEON Technology (2301.TW) has agreed to acquire approximately 25% equity ownership in Warsaw-based DCX Liquid Cooling Systems in a transaction valued at approximately US$176 million.

LITEON secures quarter stake in Polish cooling specialist

The deal gives the Taiwanese electronics group a strategic foothold in DCX POLSKA Sp. z o.o., a company founded in 2019 that builds coolant distribution units, facility coolant distribution units, cold plates and immersion cooling systems for AI and high-performance computing data centers.