San Jose – October 15, 2026 -- LITEON Technology (2301.tw) demonstrated 800 VDC rack power architectures scaling from 330kW to 1.2MW at the 2026 OCP Global Summit, targeting the megawatt-scale AI data centers its partner NVIDIA is building around.
LITEON exhibits 800 VDC Power Rack and 800V-to-50V Power Brick in NVIDIA MGX area
The company was invited to the NVIDIA MGX Ecosystem Ceremony at the summit. It was represented by John Chang, General Manager of its Cloud Infrastructure Platform and Solution SBG; Bob Weng, General Manager of the AIDC Platform SBU; and Simon Ong, President of LITEON USA.
In the MGX exhibit area, LITEON showed its NVIDIA 800 VDC Power Rack and 800V-to-50V Power Brick. The products span rack-level power architecture to power conversion, and are designed for the efficiency, power density and scalability requirements of AI data centers.
Virtual rack demo maps deployments at 330kW, 880kW and 1.2MW
At its booth, LITEON ran an interactive virtual rack experience illustrating deployments at 330kW, 880kW and 1.2MW. The demonstration traced the shift from single-rack installations to megawatt-scale AI computing environments. LITEON also presented thermal management solutions alongside the 800 VDC power architecture.
Modular MGX architecture covers single-node servers to rack-scale systems
LITEON is an NVIDIA MGX ecosystem partner and says it has been regularly invited to the ceremony in recent years. Through the modular MGX architecture, it helps customers deploy systems ranging from single-node servers to full racks.
Chang said AI workloads are growing in scale and power density, "accelerating the transformation of data center power architectures." LITEON plans to work with NVIDIA and ecosystem partners to speed adoption of 800 VDC architectures for megawatt-scale AI data centers.