NVIDIA

San Antonio – October 15, 2026 -- Singtel Digital InfraCo has received Frost & Sullivan's 2026 Southeast Asia Transformational Innovation Leadership Recognition in AI infrastructure, backed by a portfolio of 26 internationally granted patents and early deployments of four successive NVIDIA GPU platforms.

Frost & Sullivan benchmarks strategy effectiveness and execution

The analyst firm assessed the company on strategy effectiveness and strategy execution. It credited Singtel Digital InfraCo with a unified platform combining connectivity, Nxera data centre resources, high-performance GPU capacity and RE:AI's AI services.

"Rather than approaching AI infrastructure as a collection of individual technology layers," the company built an integrated operating model, said Gautham Gnanajothi, Senior Vice President at Frost & Sullivan.

San Jose – October 15, 2026 -- LITEON Technology (2301.tw) demonstrated 800 VDC rack power architectures scaling from 330kW to 1.2MW at the 2026 OCP Global Summit, targeting the megawatt-scale AI data centers its partner NVIDIA is building around.

LITEON exhibits 800 VDC Power Rack and 800V-to-50V Power Brick in NVIDIA MGX area

The company was invited to the NVIDIA MGX Ecosystem Ceremony at the summit. It was represented by John Chang, General Manager of its Cloud Infrastructure Platform and Solution SBG; Bob Weng, General Manager of the AIDC Platform SBU; and Simon Ong, President of LITEON USA.

In the MGX exhibit area, LITEON showed its NVIDIA 800 VDC Power Rack and 800V-to-50V Power Brick. The products span rack-level power architecture to power conversion, and are designed for the efficiency, power density and scalability requirements of AI data centers.

San Jose – October 15, 2026 -- Midea's Clivet brand has unveiled a magnetic-bearing centrifugal compressor that cuts compressor power by up to 40% at the same cooling capacity, targeting GW-scale AI data centers, at the 2026 OCP Global Summit.

Clivet presented the compressor and a full-chain liquid cooling solution at the "GW-Scale Open AIDC" forum. Dr. Yunxiao Ding, Director of the Research Institute at Midea Building Technologies, delivered the presentation, and Clivet received the "2026 GW-Scale Open AIDC Excellent Technical Presentation Award."

Rising cold-plate temperatures of 45°C create three engineering problems

As cold-plate supply temperatures rise toward 45°C, free cooling opportunities expand, while water constraints favor dry heat rejection. Prioritizing free cooling with mechanical-cooling backup raises three challenges:

New York – October 15, 2026 -- Mindbeam raised the Level 2 KernelBench score of NVIDIA's Nemotron 3.5 Super VL from 22.8% to 82.1% through post-training, ahead of the 57% accuracy the company reports for GPT 5.6 Sol.

The New York-based AI infrastructure company announced a collaboration with NVIDIA covering two layers of the open source AI stack: a post-trained model that writes CUDA kernels, and an inference engine that serves NVIDIA's latest open models.

Litespark Nemotron 3.5 Super VL gains 11.2 points on Level 1 tasks

Mindbeam post-trained NVIDIA's Nemotron 3.5 Super VL (120B-A12B) to produce Litespark Nemotron 3.5 Super VL, an open-weights model for CUDA code generation. The task is to take a PyTorch module and generate a raw CUDA kernel that reproduces the forward pass within tight numerical tolerances while staying architecture-agnostic.

San Jose – October 14, 2026 -- LITEON Technology (2301) is debuting a 2.6MW Enterprise Cooling Distribution Unit (CDU) and a full 800 VDC power stack for AI factories at the OCP Global Summit 2026, running October 12-15 in San Jose, California.

LITEON debuts 2.6MW CDU from investment partner DCX Liquid Cooling Systems

The Enterprise CDU comes from DCX Liquid Cooling Systems, a strategic investment partner of LITEON. It delivers up to 2.6MW of heat transfer capacity and an approach temperature of 3°C. An N+1 redundant pump design is built in for high-density AI and HPC deployments. The unit also carries a next-generation HMI and an integrated software layer for at-a-glance visibility into key system parameters.

LITEON is also showing an 800 VDC Power Shelf integrated with a Battery Backup Unit (BBU).

Washington – October 14, 2026 -- Danaher Corporation (NYSE: DHR) has launched a collaboration with NVIDIA to combine its scientific instruments, automation technologies, laboratory workflow software and domain expertise with NVIDIA accelerated computing and AI, targeting faster movement from AI prediction to experimental evidence.

Danaher and NVIDIA build a closed loop between experiments and models

The companies aim to create a continuous learning cycle in which experimental results inform AI models and the models help design better experiments. Danaher says the goal is to reduce the time and complexity of turning an AI-generated prediction into the experimental evidence needed to act on it.

Princeton – October 13, 2026 -- EDDA Technology has been named to TIME's 2026 list of the World's Top HealthTech Companies for the second consecutive year, the surgical imaging and AI company announced.

Statista partnership ranks companies on three pillars

TIME developed the list with data and rankings provider Statista. The analysis targets health technology companies that use digital technologies to make healthcare more effective and accessible. Companies were evaluated on Financial Performance, Reputation Analysis and Online Engagement.

IQQA platform has supported more than 130,000 cases

EDDA's IQQA® platform delivers 3D analysis of CT and MR images for personalized surgical and interventional planning. It has been used in more than 130,000 cases worldwide. The platform supports transplantation, resection, interventional procedures and postoperative assessment through quantitative analysis and visualization.

San Jose – October 13, 2026 -- Compal Electronics (TWSE: 2324) will show an eight-GPU, liquid-cooled NVIDIA Blackwell Ultra server alongside Rubin-based and Vera CPU systems at OCP Global Summit 2026. The company is pitching shorter time-to-AI to cloud service providers, enterprises and AI infrastructure operators.

Compal's 4U OG430-2-L1 server packs eight Blackwell Ultra GPUs

The OG430-2-L1 is a 4U direct liquid-cooled server built on the NVIDIA HGX B300 platform with eight NVIDIA Blackwell Ultra GPUs. It targets AI training, reasoning, inference and HPC workloads. Compal bundles platform engineering, liquid cooling, system validation, rack integration and manufacturing readiness to cut the engineering effort between buying new accelerators and running them in production.

San Jose – October 13, 2026 -- MSI is expanding its 21-inch ORv3 portfolio with DC-MHS-based 2-node platforms on AMD EPYC 9006 Series processors, supporting up to 600W TDP per node, at the 2026 OCP Global Summit (Booth #A49). The systems come in 2OU air-cooled and 1OU direct liquid-cooled versions and lead a booth lineup that also includes NVIDIA MGX rack and GPU server platforms and the XpertStation WS300 desktop AI supercomputer.

MSI offers two ORv3 nodes with 48V busbar power and PCIe 6.0

Both ORv3 platforms combine 48V busbar power, PCIe 6.0 connectivity and DC-SCM-based management. Memory speeds reach 8,000 MT/s with RDIMM and 12,800 MT/s with MRDIMM. Each node carries 2 PCIe 6.0 x16 expansion slots and front-access NVMe storage.

Columbus – October 12, 2026 -- Vertiv (NYSE: VRT) has advanced a production-grade digital twin for its VertivTM SmartRun system, integrated into the NVIDIA Omniverse DSX Blueprint, as the first phase of a multi-phase AI factory digital twin roadmap.

Model-based design replaces document-based handoffs across power, cooling and controls

Vertiv says document-based processes and siloed handoffs between power, cooling, controls and deployment teams cannot keep pace as AI deployments scale to higher densities and larger capacities. The SmartRun digital twin captures system configurations and dependencies in a virtual environment, so infrastructure can be designed, simulated and validated as a single system before build-out.

Vertiv expects this to reduce late-stage design changes and integration risk, and to shorten the time from planning to operational readiness.