Electronics Manufacturing

Shenzhen – October 16, 2026 -- C-TOUCH & DISPLAY SHENZHEN, FILM & TAPE EXPO and a wider program of co-located industrial technology exhibitions will run October 27-29, 2026, at the Shenzhen World Exhibition & Convention Center, with a 240-hour visa-free transit policy open to eligible visitors from 57 countries.

C-TOUCH & DISPLAY features a TGV glass substrate zone in Hall 16

C-TOUCH & DISPLAY SHENZHEN 2026 will cover AI+AR smart glasses, Micro LED, OLED, automotive displays, smart cockpits and advanced semiconductor packaging.

The TGV Glass Substrate Advanced Packaging Zone in Hall 16 will show manufacturing processes spanning glass materials, micro-via processing, metallization, copper filling and inspection. Industry conferences will address AI computing and optical interconnection, smart glasses, TGV technology and emerging display applications.

Spokane – October 15, 2026 -- AV Access has launched the 8KEX100-KVM, an HDMI 2.1 KVM extender that carries 8K@60Hz and 4K@120Hz video plus USB signals up to 100m (328ft) over a single Cat 6/6A/7 cable.

The product is now available to professional users and system integrators. It supports HDMI 2.1 and HDCP 2.3.

Single-cable design with Power over Cable cuts installation complexity

The extender runs on one Cat cable and supports Power over Cable (PoC), which AV Access says reduces cable complexity. Further features include USB 2.0 connectivity, RS-232 passthrough and EDID management for professional AV deployments.

Cambridge – October 14, 2026 -- Bulgin, an Infinite Electronics company, has added hybrid circular connectors to its 6000 Series Buccaneer range, combining two 16 A power contacts and 3 A signal contacts in one IP68-rated housing.

Hybrid design removes the need for separate power and signal cable routing

The 6000 Series Hybrid Buccaneer is aimed at smaller devices such as test and measurement equipment, sensors and control systems. Integrating both connection types in a single interface cuts space requirements and eliminates separate cable routing for power and signal.

Two central power contacts are rated at 16 A. Designers can choose from three configurations with two, four or six 3 A signal contacts.

Mark Berry, VP of Product & Portfolio Management at Infinite Electronics, said the company integrated high-current power and signal channels into one sealed interface to deliver a smaller footprint without compromising performance.

Albany – October 14, 2026 -- IBM and Siemens have launched a joint research program to prepare IBM's nanostack transistor architecture, which packs nearly 100 billion transistors into a space the size of a fingernail at the 7 angstrom node, for volume manufacturing.

Nanostack stacks and staggers transistors in three dimensions

IBM describes nanostack as the industry's first known three-dimensional, nanosheet-based design. It vertically stacks and staggers transistors to raise density. The architecture also allows different material combinations in each stacked layer, so each transistor's performance and power efficiency can be optimized independently of the other.

IBM credits the design with substantial gains in energy efficiency, performance and SRAM scaling. It unveiled the architecture earlier this year and has demonstrated that it is viable.

Vienna – October 14, 2026 -- Viewpointsystem has launched an eye-tracking module that delivers up to 15 times longer battery runtime than conventional processing on a connected device, according to the company's performance measurements. The Digital Iris Module runs the complete image-based eye-tracking pipeline at 140 Hz on an ultra-low-power Ensemble microcontroller (MCU) from Alif Semiconductor, inside the glasses frame.

Power consumption, heat generation and limited space have so far made eye tracking hard to add to lightweight smart glasses, the company said. Conventional systems send images from eye-facing cameras to a main application processor in the glasses or a connected device. Processing those streams draws power, generates heat and adds system complexity.

Fort Washington – October 13, 2026 -- Kulicke & Soffa Industries (NASDAQ: KLIC) has been named the recipient of the 2026 SEMI Award for North America for its fluxless thermocompression bonding (FTC) technology, which enables interconnect pitches below 10 microns.

The award is presented during the CEO Summit Keynotes at SEMICON West. SEMI describes it as one of the semiconductor industry's highest honors for technical and commercial contributions to manufacturing.

San Jose – October 13, 2026 -- QuickLogic Corporation (NASDAQ: QUIK) has won a six-figure initial contract for its embedded FPGA (eFPGA) Hard IP, to be used in a programmable system-on-chip (SoC) built on a 16nm automotive process technology.

The SoC targets battery management, precision motor control and industrial robotic applications. QuickLogic expects the contract to generate license revenue over the next six months. Royalty revenue is anticipated once the customer begins production shipments.

Oslo – October 13, 2026 -- Nordic Semiconductor (OSE: NOD) is marking 10 years of its ultra-low-power wireless technology inside the BBC micro:bit, a board that has helped an estimated 73.5 million young people in more than 85 countries learn coding, according to the Micro:bit Educational Foundation.

Foundation targets 100 million young people by 2028

The Foundation is calling on industry and education to work together so children can understand, question and create with technology. Its goal is to reach 100 million young people by 2028.

The program began in 2016, when up to one million micro:bit boards with Nordic wireless technology were distributed to school-children across the UK through the BBC Make it Digital campaign. Foundation CEO Gareth Stockdale said Nordic supplied a million components for the original board, which went to every Year 7 student in the UK.

Delray Beach – October 12, 2026 -- The global terahertz technology market is estimated at USD 1.07 billion in 2026 and is projected to reach USD 2.62 billion by 2032, a CAGR of 16.0%, according to MarketsandMarkets.

Non-destructive testing demand lifts inspection unit counts per facility

Expanding non-destructive testing and advanced quality control are increasing the number of terahertz inspection units deployed in each production facility. As precision requirements rise and packaging architectures grow more complex, terahertz tools are supplementing or replacing traditional ultrasonic and ionizing X-ray inspection.

Enterprise operators are adopting terahertz time-domain spectroscopy, continuous-wave imaging radars and quantum cascade laser sources. Emerging applications include semiconductor packaging inspection, AI-based defect classification, non-ionizing pharmaceutical validation and 6G communication testbeds.

San Jose – October 12, 2026 -- Texas Instruments (Nasdaq: TXN) unveiled the ADC34DSO75, a 3 gigasamples-per-second analog-to-digital converter that it says enables 24/7, low-power, event-based remote monitoring at nanosecond resolution, thousands of times faster than current solutions.

The company debuted the device at the Open Compute Project (OCP) Global Summit alongside two other analog products aimed at AI data center power instability, inadequate real-time monitoring and signal degradation. TI says these problems can lead to costly downtime.

ADC34DSO75 targets nanosecond power-rail glitches that cause downtime

TI says existing monitoring tools often miss nanosecond-level power-rail glitches behind unplanned outages. The ADC34DSO75 combines ultra-high-speed sampling with on-chip digital signal processing in a small form factor to detect and capture transient fault events in real time.