Ceva, LG Electronics Combine UWB Tech, Land Major US Chipmaker Client
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Rockville, Md. and Seoul, South Korea – September 13, 2026 -- Ceva, Inc. (NASDAQ: CEVA) and LG Electronics have secured a major U.S. semiconductor company as a customer for a jointly developed Ultra-Wideband (UWB) solution, marking commercial validation for the two-company collaboration announced today.
Ceva's baseband IP pairs with LG's RF technology on TSMC's 22nm process
The partnership combines Ceva-Waves UWB baseband and software with UWB radio frequency technology developed by LG's SoC Center, built on TSMC's 22nm process node. The integrated platform targets semiconductor and OEM developers building automotive, industrial and consumer products, aiming to cut engineering effort and integration risk for companies building UWB-enabled SoCs.