Munich – – September 15, 2026 -- Silicon Line, a brand of EverProX Technologies Munich GmbH, has launched the MSDL 20G chipset, extending MIPI D-PHY connectivity from short-range cabling to distances of tens of meters while consuming less than 100 mW per 10 Gbps link.
Chipset aggregates dual 10 Gbps camera streams over fiber or copper
The MSDL 20G family comprises the SL8582x serializer and SL8581x deserializer, supporting up to two simultaneous serialized links of 10 Gbps each for multi-camera vision systems. The chipset targets bandwidth, EMI, and range limitations inherent in traditional MIPI D-PHY wiring, replacing bulky shielded cable bundles with optical fiber or differential copper connections.
Power consumption drops to 71 mW in optical mode, 87 mW electrical
In optical mode, the serializer draws 17 mW and the deserializer 54 mW typical; electrical mode consumes 27 mW and 60 mW respectively, excluding the integrated sideband SerDes. VCSEL drivers and integrated TIA support optical links beyond tens of meters, while differential copper links extend up to 2 meters. An integrated bidirectional sideband SerDes carries I2C, GPIO, digital audio, SPI/control, and sensor clock signals alongside MIPI data, cutting cable count and connector complexity.
CEO cites physical AI as driver for distributed sensor architectures
"Physical AI is transforming how electronic systems are built. We are seeing faster and more efficient cameras, more sensors and more distributed intelligence across devices," said Yifeng Liann, CEO of EverProX Technologies Munich GmbH. He said engineers must balance flexibility, reliability beyond wireless connectivity, and ultra-low power for viable system integration.
Target applications span AR/VR, medical endoscopy, industrial robotics and defense
The chipset addresses AR/VR devices requiring lighter, more flexible connections; medical endoscopy supporting 4K/8K imaging with low heat generation; industrial robotics and machine vision needing EMI-immune high-speed links; and defense/UAV systems requiring lightweight, low-power multi-camera connectivity to extend battery life.
Samples ship in bare chip or 4x4 mm μBGA-78 packages
MSDL 20G components (SL8582x and SL8581x) are available for sampling to early-access customers in bare chip form or compact μBGA-78 packages measuring 4 x 4 mm. Evaluation kits are available for link validation, with EverProX providing assembly support from IC design through mass production.