Munich – September 08, 2026 -- EverProX Technologies Munich GmbH, under its Silicon Line brand, has launched the MSDL 20G chipset, extending MIPI D-PHY camera connectivity to tens of meters while consuming less than 100 mW per 10 Gbps link.
Chipset pairs SL8582x serializer with SL8581x de-serializer for dual 10 Gbps streams
The MSDL 20G, first product in the new MSDL family, aggregates up to two simultaneous MIPI D-PHY camera streams at up to 10 Gbps each over serialized optical or copper links. Integrated VCSEL drivers and TIA support optical reach of tens of meters, while differential copper links extend up to 2 meters.
Power draw stays below 100 mW per link across optical and electrical modes
In optical mode, the serializer consumes 17 mW and the de-serializer 54 mW typical, totaling 71 mW per link. Electrical mode draws 27 mW at the serializer and 60 mW at the de-serializer, totaling 87 mW, excluding the integrated sideband SerDes. The sideband channel carries I2C, GPIO, digital audio, SPI/control signals and sensor clocks alongside MIPI data, cutting cable count and connector complexity.
Design targets AR/VR, medical endoscopy, robotics and defense multi-camera systems
Silicon Line positions the chipset for lighter AR/VR tethering, 4K/8K medical endoscopy with low heat output, EMI-immune machine vision in industrial settings, and lightweight multi-camera links for UAVs that extend battery life. The company states the architecture eliminates bulky shielded cable bundles that constrain high-resolution multi-camera and high-frame-rate display systems.
CEO ties launch to rising sensor density in physical AI systems
Yifeng Liann, CEO and Managing Director of EverProX Technologies Munich GmbH, said engineers must balance flexibility, reliability and ultra-low power as systems distribute more cameras, sensors and intelligence across devices, adding that Silicon Line built the chipset to make high-bandwidth connectivity more energy-efficient and easier to integrate.
Samples ship now in bare die or 4x4 mm micro-BGA packages
The SL8582x and SL8581x are sampling with early-access customers in bare die or compact 4x4 mm uBGA-78 packages. Evaluation kits are available for link validation, with EverProX offering turnkey assembly support for the transition from IC design to mass production.