semiconductors

Hanoi – November 03, 2026 -- Vietnam's Government Cipher Committee and Viettel Group have unveiled VGC v1.0, a 28-nanometre security chip that runs a domestically developed cryptographic algorithm in silicon and performs encryption and decryption about 15 times faster than a software-only solution.

VGC v1.0 packs 300 million transistors into a 10 x 10 mm package

The chip is fabricated on a 28-nanometre CMOS process. Its first batch passed technical tests and received certification for socio-economic applications in the first quarter of 2026. Technical safeguards applied before fabrication are designed to reduce the risk of information leakage and reverse engineering.

The project targets data-exposure risks tied to imported chips. Embedding cryptographic functions in hardware is meant to give Vietnam more control over how the technologies protecting sensitive information are designed and verified.

ATSUGI – October 29, 2026 -- Sony Semiconductor Solutions Corporation announced the LYTIA 720, an approximately 50-effective-megapixel CMOS image sensor for mobile devices that cuts random noise in dark environments by about 50% compared with a conventional product.

LYTIA 720 targets smartphone main cameras in a 1/1.56-type format

The sensor is designed for the main camera of mobile devices. It inherits technologies developed for Sony's LYTIA high-end series. Sony chose the 1/1.56-type size because it is widely adopted in the smartphone market, and says the aim is to bring high-quality imaging to more users.

Burlington – October 25, 2026 -- GlobalFoundries (GF) has qualified RFGaN1, its first RF GaN-on-silicon technology for volume production on 200mm wafers. It has also qualified SLATE, a wafer-bonding technology that cuts RF die area by up to 45% with no loss in RF performance.

RFGaN1 runs at 12 to 28V across 1 to 15 GHz

The platform uses depletion-mode devices and targets sustained high output power and efficiency in satellite communications, cellular infrastructure and defense. Dan Denninghoff, Senior Director of RF GaN Product Line, said GaN has so far been a niche, high-budget option. GF argues that 200mm silicon manufacturing gives customers the cost structure and volume to build a supply chain around it instead of treating each design as a one-off.

San Jose – October 13, 2026 -- QuickLogic Corporation (NASDAQ: QUIK) has won a six-figure initial contract for its embedded FPGA (eFPGA) Hard IP, to be used in a programmable system-on-chip (SoC) built on a 16nm automotive process technology.

The SoC targets battery management, precision motor control and industrial robotic applications. QuickLogic expects the contract to generate license revenue over the next six months. Royalty revenue is anticipated once the customer begins production shipments.

Shanghai – September 09, 2026 -- NOVOSENSE (HKEX: 02676) reported first-half 2026 revenue of approximately $374.54 million, up 66.73 percent year-on-year, with net profit attributable to shareholders reaching $9.97 million. The analog and mixed-signal IC maker has posted sequential quarterly revenue growth for several consecutive quarters.

Automotive electronics revenue climbs 60% as cumulative shipments surpass 1.95 billion units

Automotive electronics revenue rose about 60 percent, accounting for 32.38 percent of total first-half revenue. NOVOSENSE shipped 534 million automotive chips during the period, pushing cumulative shipments past 1.95 billion units.