Delray Beach – September 09, 2026 -- The global thermoplastic polyimide market is projected to expand from $0.56 billion in 2026 to $0.86 billion by 2032, growing at a compound annual rate of 7.4%, according to MarketsandMarkets.
Data center cooling and aerospace demand drive material adoption
Rising cloud computing, AI workloads, and big data processing are increasing heat generation in data centers, pushing operators toward high-performance thermal materials. Aerospace and defense manufacturers are also adopting thermoplastic polyimide for components requiring lightweight, high-temperature stability, alongside growing automotive and industrial machinery use cases demanding chemical and wear resistance.
Asia Pacific commands 35% share and leads growth through 2032
Asia Pacific held the largest regional share of the market in 2025 at 35% and is forecast to post an 8.3% CAGR between 2026 and 2032, outpacing the global average. Expansion is tied to electronics and semiconductor manufacturing investment, automotive production, and established polyimide supply chains across China, Japan, and South Korea.
Electrical and electronics segment to grow at 8.3% CAGR
By end-use industry, electrical and electronics applications are set to expand at 8.3% annually through 2032, driven by demand for connectors, wire and cable components, optical parts, and semiconductor manufacturing equipment. By form, resin is projected to hold the largest market size by 2032 with a 7.4% CAGR, supported by injection molding and extrusion use in bearings, seal rings, and precision electronic components. The unfilled thermoplastic polyimide segment is forecast to grow at 6.8% CAGR, while injection molding is set to remain the leading processing technique.
Top five suppliers control 60–70% of the market
Mitsui Chemicals, SABIC, Mitsubishi Gas Chemical, Wanhua Chemical, and Kingfa Sci. & Tech. together hold an estimated 60–70% combined market share, reflecting a consolidated but competitive landscape. Additional named producers include Solver Polyimide, Huntsman, Jiangsu Junhua Hpp, Changzhou Sunchem New Material, Arakawa Chemical Industries, Arkema, Evonik, Allstar Material, Jiangsu Qingquan Chemical, and Kingfa Sci. & Tech.
Arkema raised EUR 400 million via hybrid bond in 2025
Arkema completed a EUR 400 million (approximately $464.9 million) undated hybrid bond issuance in 2025, primarily to refinance an existing hybrid bond and diversify financing sources. Mitsui Chemicals is expanding its AURUM thermoplastic polyimide range into semiconductor manufacturing equipment, automotive parts, and aerospace applications, while SABIC has introduced new EXTEM grades targeting optical interconnect uses. Wanhua Chemical has built out its own thermoplastic polyimide production capabilities, marking increased participation from Chinese manufacturers in the specialty engineering materials segment.