DALLAS – November 05, 2026 -- Texas Instruments (Nasdaq: TXN) has introduced a system-on-module that lets engineers switch between EtherCAT, EtherNet/IP and Profinet through a firmware update, alongside a dual-channel IO-Link master aimed at sensor-to-network integration in factory automation, robotics and Industrial IoT systems.
TICS100MOD runs three Industrial Ethernet protocols on one board
The TICS100MOD is built on TI's AM2612 microcontroller and DP83826AI Ethernet physical layer. TI describes it as the industry's smallest fully featured, certified communications SoM. Engineers select the protocol at boot time via firmware, so a single hardware design can serve different customer or regional requirements without a redesign.
The module integrates two Arm Cortex-R5F cores and external memory. TI says this is enough compute for fully featured protocol stacks and advanced factory automation applications.
TIOM2212 connects IO-Link field devices to Industrial Ethernet
The TIOM2212 is a dual-channel IO-Link master with advanced analog integration and built-in protection features. It works with TI's Sitara industrial networking SoC family and AM13Ex real-time MCUs through an integrated frame handler. TI says this reduces the design complexity and cost of bridging field devices and factory control systems.
With the TIOM2212, TI now supplies every hardware layer of the IO-Link ecosystem: transceivers, digital output switches and a master device with an integrated frame handler.
Single-vendor sourcing targets cost and supply-chain risk
TI argues that multiprotocol networks typically require separate hardware for each protocol, which raises cost, design complexity and time. Sourcing hardware and software from one vendor, it says, simplifies integration and customization, reduces supply-chain risk and streamlines long-term platform maintenance.
The approach centers on the programmable real-time unit and industrial communication subsystem (PRU-ICSS), a proprietary block in TI MCUs and SoCs. It handles deterministic, low-latency protocols and frees the general-purpose Arm CPUs for other functions. TI cites process data cycle times it calls industry-leading, full media access control layer access and an SDK with certified, production-ready protocol stacks.
SICK is bringing the SIG300 to market on TI's Ethernet and IO-Link parts
Dr. Stefan Odermatt, senior vice president of research and development, integrated automation at SICK, said TI's Industrial Ethernet and IO-Link solutions help SICK deliver products such as the SIG300 with the performance and reliability modern automation requires. Karim Jamal, director of Industrial Communication Solutions at TI, said customers need help adapting to emerging standards.
TIOM2212 samples ship now; TICS100MOD follows by year-end 2026
Preproduction quantities of the TIOM2212 are available now on TI.com. The TICS100MOD will be available by year-end 2026. Evaluation modules and the industrial communication SDK are also offered.
TI will demonstrate the TICS100MOD at electronica in Munich, Nov. 10-13, in Hall C4, booth 159. One demo covers multiprotocol Industrial Ethernet integration. A second covers newer industrial communication technologies, including integrated neural processing units and time-sensitive networking.