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Spirox Launches SP7000G High-Speed TGV Crack Inspection System

Spirox Launches SP7000G High-Speed TGV Crack Inspection System

Hsinchu – September 11, 2026 -- Spirox Corporation (TWSE: 3055) unveiled its SP7000G high-speed TGV crack inspection system, a tool designed to support mass production testing of glass substrates for next-generation AI and HPC packaging.

Spirox scans a full 510mm by 515mm glass substrate in under 20 minutes

The SP7000G detects internal micro-cracks after metallization and ABF build-up processes, according to the company. Spirox positions the system to improve inspection efficiency, monitor process quality and defect distribution, and optimize yield as Through Glass Via (TGV) technology moves toward volume manufacturing.

Spirox Unveils SP7000G High-Speed Crack Inspection System for TGV

Spirox Unveils SP7000G High-Speed Crack Inspection System for TGV

Hsinchu – September 11, 2026 -- Spirox Corporation (TWSE: 3055) has launched the SP7000G, a high-speed crack inspection system for Through Glass Via (TGV) technology, capable of scanning a full 510mm x 515mm glass substrate in under 20 minutes.

Spirox debuts SP7000G to detect microcracks in high-volume glass core manufacturing

The system targets internal microcracks that emerge after metallization and ABF build-up processes, key failure points as manufacturers scale glass core and TGV production for AI and high-performance computing applications. Spirox positioned the SP7000G alongside its existing SP8000G unit, which is used for R&D and quality-control analysis, to offer customers both high-volume production inspection and detailed defect analysis on a single substrate.