Hsinchu – September 11, 2026 -- Spirox Corporation (TWSE: 3055) has launched the SP7000G, a high-speed crack inspection system for Through Glass Via (TGV) technology, capable of scanning a full 510mm x 515mm glass substrate in under 20 minutes.
Spirox debuts SP7000G to detect microcracks in high-volume glass core manufacturing
The system targets internal microcracks that emerge after metallization and ABF build-up processes, key failure points as manufacturers scale glass core and TGV production for AI and high-performance computing applications. Spirox positioned the SP7000G alongside its existing SP8000G unit, which is used for R&D and quality-control analysis, to offer customers both high-volume production inspection and detailed defect analysis on a single substrate.
Corning and DNP executives join Spirox forum to discuss Glass Core reliability challenges
The product launch coincided with Spirox's Advanced Packaging Technology Forum, which brought together representatives from Corning and DNP to discuss reliability and inspection technologies for next-generation AI and HPC packaging. Corning's Odessa Petzold said Spirox's laser tomography scanning technology offers a non-destructive approach to detecting defects within glass structures without damaging the material, calling it valuable for advanced TGV packaging processes.
DNP's Satoru Kuramochi said reliability and failure analysis will become increasingly critical as Glass Core technologies move toward mass production to meet rising demand for high-density AI server packages. He said non-destructive inspection technologies must play a central role in detecting defects across manufacturing stages.
Spirox positions TGV inspection tools for transition to mass-volume semiconductor packaging
Paul Yang of Spirox said TGV is moving toward large-scale production, making inspection efficiency and quality control essential. He said the SP7000G was designed specifically for mass-production needs, providing faster, more accurate, non-destructive full-substrate inspection and analysis capabilities.
Glass Core and TGV technologies are emerging as key components for next-generation semiconductor encapsulation as AI, HPC, and HBM development accelerates demand for advanced packaging solutions.