Hsinchu – September 11, 2026 -- Spirox Corporation (TWSE: 3055) unveiled its SP7000G high-speed TGV crack inspection system, a tool designed to support mass production testing of glass substrates for next-generation AI and HPC packaging.
Spirox scans a full 510mm by 515mm glass substrate in under 20 minutes
The SP7000G detects internal micro-cracks after metallization and ABF build-up processes, according to the company. Spirox positions the system to improve inspection efficiency, monitor process quality and defect distribution, and optimize yield as Through Glass Via (TGV) technology moves toward volume manufacturing.
Corning and DNP executives back non-destructive laser tomography for glass core testing
The announcement came at Spirox's Advanced Packaging Technology Forum, where Odessa Petzold of Corning said the company's laser tomography scanning technology offers an innovative approach to non-destructive testing of glass materials, capable of detecting defects in glass structures without damaging the material. Petzold called it a valuable tool for advanced packaging processes such as TGV, helping accelerate the transition to mass production.
Satoru Kuramochi of DNP said reliability and failure analysis will grow in importance as glass-core technologies move into mass production, driven by AI server demand for high-density, high-performance packaging. DNP presented its work on improving the reliability of glass-core substrates for large AI data server packages at the forum.
Spirox positions SP7000G alongside its SP8000G for full substrate coverage
Paul Yang of Spirox Corporation said the SP7000G is built for mass-production requirements and complements the company's SP8000G, which is used for R&D and quality-control analysis. Together, Yang said, the two systems give customers non-destructive inspection and analysis capability across the full substrate. Spirox said it will continue expanding its proprietary testing technologies to support customers advancing mass production of next-generation packaging.