SEMI

K&S Wins 2026 SEMI Award for Fluxless Thermocompression Bonding

Fort Washington – October 14, 2026 -- Kulicke & Soffa Industries (NASDAQ: KLIC) has been named the recipient of the 2026 SEMI Award for North America for its fluxless thermocompression bonding (FTC) technology, which enables interconnect pitches below 10 microns.

The award is presented during the CEO Summit Keynotes at SEMICON West. SEMI describes it as one of the semiconductor industry's highest honors for technical and commercial contributions to manufacturing.

SEMI: 300mm Fab Equipment Spending to Hit $227B by 2029

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SEMI: 300mm Fab Equipment Spending to Hit $227B by 2029

San Francisco – October 14, 2026 -- Global 300mm front-end fab equipment spending will reach $149 billion in 2026, up 31% year-over-year, and climb to $227 billion by 2029, according to the latest SEMI 300mm Fab Outlook. SEMI projects investment will keep growing at double-digit rates through the forecast period.

SEMI projects 20 new 300mm fabs or lines will start construction worldwide in 2026

Excluding pure R&D fabs, SEMI expects 18 more construction starts in 2027. In the United States, three fabs or lines are projected to begin construction in 2026 and four in 2027.

SEMI also projects 13 new 300mm fabs or lines worldwide will begin operations or ship first silicon in 2026, rising to 23 in 2027.

Chip Equipment Billings Hit Record $40.53B on AI Demand Surge

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Chip Equipment Billings Hit Record $40.53B on AI Demand Surge

Milpitas, Calif. – September 09, 2026 -- Global semiconductor equipment billings climbed 23% year-over-year to $40.53 billion in the second quarter of 2026, marking a second consecutive record quarter, according to SEMI's Worldwide Semiconductor Equipment Market Statistics (WWSEMS) report.

Quarterly billings grew 11% sequentially as AI infrastructure spending accelerated
The second-quarter figure represents an 11% quarter-over-quarter increase, building on the prior record set in the first quarter of 2026. SEMI attributed the sustained growth to rising demand for advanced manufacturing capacity tied to AI computing infrastructure buildouts.