Seoul – September 12, 2026 -- DB HiTek has completed reliability qualification for its 1200V silicon carbide (SiC) MOSFET process on 8-inch (200mm) wafers, becoming the first foundry to build a complete process chain for 8-inch SiC MOSFET production at this voltage class. The South Korean pure-play foundry plans to launch mass production in 2027, targeting the electric vehicle, renewable energy and industrial power electronics markets.
DB HiTek builds world-first 8-inch SiC foundry process chain
The company developed an end-to-end foundry process covering design, manufacturing, electrical characterization and reliability qualification for 8-inch SiC MOSFET devices rated at 1200V. Most SiC wafer production today runs on 6-inch substrates, but major chipmakers are shifting to 8-inch wafers to cut costs and improve manufacturing efficiency, a transition DB HiTek says it is positioned to capture.
PDK rollout aims to cut customer development timelines by over a year
DB HiTek has distributed first- and second-generation Process Design Kits (PDKs) for its 1200V SiC MOSFET process to customers, with a third-generation PDK scheduled for release in November. The company says the kits let customers reduce early-stage development resources, accelerate prototyping, and shorten product development timelines by more than one year.
Second-generation process hits 2.5 mΩ•cm2 resistance, passes reliability testing
The qualified second-generation process achieves a specific on-resistance (Rsp) of 2.5 mΩ•cm2 or lower and a threshold voltage (Vth) of at least 3V at an on-state gate-source voltage (Vgs(on)) of 18V. This process has cleared reliability qualification, a demanding technical milestone in SiC process development.
Third-generation process targets lower resistance and stronger short-circuit tolerance
The third-generation process, set for release in November, is being qualified to reach a specific on-resistance of 2.3 mΩ•cm2 or lower at the same 18V Vgs(on), alongside a short-circuit withstand time (SCWT) of at least 2.5 microseconds within a safe operating area. DB HiTek plans to release the corresponding PDK once this qualification is finalized.
Foundry timeline: existing clients get access in Q3, full rollout follows in 2027
DB HiTek intends to finalize process preparations and make the technology available to existing customers in the third quarter of this year, with availability extended to all customers starting the second quarter of 2027. A company representative said the qualification milestone demonstrates the process technology and manufacturing infrastructure required to offer what the firm calls the world's first 8-inch SiC foundry service, adding that preparations for 2027 mass production will continue as the company works to strengthen its position in the power semiconductor foundry sector.