AI Infrastructure & Data Centers

San Jose – October 14, 2026 -- CyberTAN Technology has unveiled a liquid-cooled Ethernet switch platform architecture built around Marvell's 102.4 Tbps Teralynx T100 silicon, and says a live demonstration at OCP Global Summit 2026 reached a Power Usage Effectiveness (PUE) of 1.1.

Pallas Series targets 1,000-watt heat loads with direct-to-chip cooling

The Pallas Series 1.6T platform is designed to accommodate the 3nm Marvell T100 and its 25% energy-saving advantage. CyberTAN pairs the silicon with its proprietary Direct-to-Chip (D2C) liquid-cooling engineering. The company says the design can manage more than 1,000 watts of localized heat dissipation while keeping port density high.

CyberTAN frames the work as a response to thermal and power limits in AI clusters, where generative AI and hyperscale workloads are driving demand for more efficient silicon and rack-level cooling.

San Jose – October 14, 2026 -- UfiSpace is demonstrating a live 102.4Tbps liquid-cooled switch with 64 x 1.6T OSFP ports at OCP Global Summit 2026, aiming to prove thermal feasibility for 1.6T AI fabrics as data centers move toward extreme power densities.

Liquid-cooled Tomahawk 6 platform runs with a cooling distribution unit

The S9331-64HO3L is a 2OU ORv3 platform built on the Broadcom Tomahawk 6 ASIC. It operates with a Cooling Distribution Unit (CDU) to deliver real-time cooling. UfiSpace describes it as a validation-ready, early-access architecture and a proof-of-concept for the thermal and mechanical designs needed for 2027/2028 AI clusters.

San Jose – October 14, 2026 -- Wiwynn, Ayar Labs and Global Unichip Corp. (GUC) are showing the first live demonstration of a compute system that integrates GUC's ASIC with Ayar Labs' TeraPHY optical engine and SuperNova light source while streaming real-time health telemetry, at OCP Global Summit 2026.

Demo moves CPO from rack-level architecture to platform integration and functional validation

The demonstration advances the companies' earlier rack-level architecture collaboration. Wiwynn's system integrates GUC's multi-chip packages (MCPs) with TeraPHY optical engines (OEs), powered by the Ayar Labs SuperNova light source. Telemetry is continuously polled from the OEs inside the MCPs and displayed in real time, showing the optical link is up within the system.

Frederick – October 14, 2026 -- Aligned Data Centers has become Co-Presenting Sponsor of the 2nd annual Blue & Bubbly dinner, a fundraiser for Boys & Girls Clubs of Frederick County (BGCFC), where about 56% of youth served receive financial aid toward membership dues.

Aligned backs the 2nd annual Blue & Bubbly event at 7th Sister Restaurant

BGCFC announced the partnership. The event is scheduled for Thursday, October 8, at 7th Sister Restaurant. Proceeds will help keep Club programs affordable for youth and families across Frederick County.

Columbus – – October 13, 2026 -- Vertiv (NYSE: VRT) has acquired Strategic Thermal Labs LLC (STL), a specialist in advanced liquid-cooling technologies, to strengthen its engineering capability where server-side liquid cooling meets supporting infrastructure in AI and high-performance computing environments. Financial terms were not disclosed.

STL adds cold-plate design and high-density thermal validation expertise

STL brings cold-plate design, server-side liquid cooling and high-density thermal validation capabilities. Vertiv expects the expertise to improve its ability to simulate and emulate real high-density compute conditions.

The company also expects to optimize the interaction between the thermal chain and the power train. It plans to support customers across design, integration, commissioning and lifecycle operations.

Columbus – October 13, 2026 -- Vertiv (NYSE: VRT) has advanced a production-grade digital twin for its VertivTM SmartRun system, integrated into the NVIDIA Omniverse DSX Blueprint, as the first phase of a multi-phase AI factory digital twin roadmap.

Model-based design replaces document-based handoffs across power, cooling and controls

Vertiv says document-based processes and siloed handoffs between power, cooling, controls and deployment teams cannot keep pace as AI deployments scale to higher densities and larger capacities. The SmartRun digital twin captures system configurations and dependencies in a virtual environment, so infrastructure can be designed, simulated and validated as a single system before build-out.

Vertiv expects this to reduce late-stage design changes and integration risk, and to shorten the time from planning to operational readiness.

Columbus – October 13, 2026 -- Vertiv (NYSE: VRT) has completed its acquisition of ThermoKey S.p.A., adding heat rejection and heat-exchange manufacturing capacity in Europe, the Middle East and Africa (EMEA) as AI factories and high-density data centers drive demand for thermal systems. The release does not disclose financial terms.

ThermoKey adds heat-exchange and dry cooler technology to Vertiv's thermal chain

ThermoKey supplies heat-exchange solutions and dry coolers, and its technology is compatible with low-GWP and natural refrigerants. Vertiv says this complements its existing portfolio and lets customers optimize for performance, site conditions and growth. The company already uses ThermoKey technologies in select thermal solutions.

Columbus, Ohio – October 13, 2026 -- Vertiv (NYSE: VRT) has opened a manufacturing facility in Johor, Malaysia, to serve rising demand for AI and high-density computing infrastructure across Southeast Asia, North Asia, Australia and New Zealand. The site is expected to bring hundreds of skilled jobs to the region once fully operational in 2027.

The plant adds regional manufacturing, engineering, logistics and deployment capacity in one of Southeast Asia's fastest-growing industrial markets. Vertiv cites the site's regional connectivity and proximity to key technology and customer hubs.

Johor plant handles manufacturing, assembly and full-scale witness testing

The facility covers end-to-end manufacturing, assembly and full-scale witness testing of thermal and power infrastructure. Vertiv says validated performance reduces deployment risk and speeds time to capacity for enterprise, cloud and colocation customers.

Tognana, Italy – October 13, 2026 -- Vertiv expects to double chiller production capacity at its Tognana campus near Padua by the end of 2026, as demand for AI and high-density computing infrastructure drives investment in data center cooling.

The NYSE-listed company will also complete a new large-scale testing laboratory in early 2027, adding integrated validation capacity to the site.

New laboratory will test chillers with liquid cooling under extreme loads

The facility will test large-scale chillers and validate how they integrate with liquid cooling systems under high-density load conditions and extreme temperature ranges. Vertiv says the capability lets customers verify thermal performance under expected site conditions. The aim is to deploy increasingly complex cooling systems with greater speed and confidence.

Columbus, Ohio – October 13, 2026 -- Vertiv has deployed a three-rack SmartIT integrated AI infrastructure configuration at the Naval Postgraduate School (NPS) to support the school's new NVIDIA DGX GB300 system, converting an existing facility into a high-density, liquid-cooled environment.

NVIDIA supplied the DGX GB300 system. Vertiv provided and deployed the supporting physical infrastructure, engineering expertise and installation services needed to bring the environment online. The project covers education, research, digital engineering, modeling and simulation.