swop 2024 to Spotlight Packaging Technology Innovation and Intelligent Development
SHERIDAN, WYOMING – August 26, 2024 – The Shanghai World of Packaging (swop) 2024 is set to take center stage in the global packaging industry, showcasing cutting-edge machinery, innovative materials, and advanced technologies. The event, scheduled for November 18-20 at the Shanghai New International Expo Center, will gather over 900 exhibitors across 65,000 square meters of exhibition space, offering a comprehensive platform for industry professionals to explore the latest trends and solutions in packaging.
Focus on Innovation and Intelligence