SHANGHAI – November 05, 2026 -- NSING Technologies has shipped more than 250 million Bluetooth chips incorporating Ceva-Waves Bluetooth Low Energy (LE) IP, licensor Ceva, Inc. (NASDAQ: CEVA) announced.
NSING builds its Bluetooth portfolio on Ceva's licensed connectivity IP
The Chinese semiconductor company combines Ceva's Bluetooth LE technology with its own low-power RF designs and MCU architectures. According to Ceva, this approach shortened product development and kept performance and standards compliance consistent across successive product generations.
N32WB452 and N32WB03x series drive applications from toll collection to e-bikes
The collaboration covers multiple product generations, including NSING's N32WB452 series of dual-core Bluetooth LE MCUs and its N32WB03x series of ultra-low-power Bluetooth LE SoCs. Target applications include electronic toll collection, wireless remote controls, smart lighting, e-bike security systems, indoor positioning and industrial wireless connectivity. Shipments also reach wearables, consumer electronics, smart home and automotive devices.
Ceva ties the volume milestone to its royalty-based licensing model
Ziv Hammer, Executive Vice President of Ceva's Connectivity & Sensing Division, said the milestone shows how IP licensing translates into "sustained, high-volume production and long-term royalty opportunities." Ceva says its IP is deployed in billions of devices worldwide.
Xinhui Mu, Vice President at NSING Technologies, said the company plans to expand into new markets and applications.
Ceva-Waves also covers Bluetooth Dual Mode, Bluetooth High Data Throughput (HDT), Wi-Fi and Ultra-Wideband (UWB). These technologies form the Connect pillar of Ceva's Connect, Sense and Infer strategy for Physical AI.