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Overlord Labs Closes $10M Seed to Scale Battery Chip for Edge AI

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Overlord Labs Closes $10M Seed to Scale Battery Chip for Edge AI

San Jose, Calif. – September 25, 2026 -- Overlord Labs, Inc. has closed an oversubscribed Seed round, lifting total funding to $10 million as the fabless semiconductor company moves its GENESIS Battery Intelligence IC from tape-out into product validation.

Seed extension totals $4.35 million led by Band of Angels

The financing comprises $7.25 million in Seed capital and the remainder in non-dilutive strategic development funding. The $4.35 million extension was led by Band of Angels, with participation from Foothill Ventures, Unlock Pacific Ventures, NuFund Venture Group, Sand Hill Angels and Castle Fund, alongside returning angel investors from earlier rounds.

Flagship chip targets single-cell systems for wearables and smart glasses

The GENESIS device, built on Overlord Labs' proprietary Silicon x Algorithm Architecture, is designed for single-cell battery systems and supports both established and emerging chemistries, including silicon-anode cells. Initial target applications include smart glasses, wearables, hearables and other edge AI devices facing tight power and form-factor constraints.

Company targets volume production in first half of 2027

Overlord Labs will direct the capital toward completing validation and qualification, supporting customer sampling and Tier-1 OEM engagements, expanding firmware and battery-algorithm capabilities, and building production infrastructure. Volume production is targeted for the first half of 2027.

"We now have working silicon, active customer engagement and an investor syndicate, including angels who came back to invest again, that understands the scale of the opportunity," said Richard Nicholson, Co-Founder and Chief Executive Officer of Overlord Labs. Co-Founder and Chief Operating Officer Carlos Rodriguez said the company engineered GENESIS to let OEMs scale performance, form factor and battery life without the traditional trade-offs among the three.

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