LITEON Brings 800 VDC AI Power Stack to electronica 2026
Munich – November 06, 2026 -- LITEON Technology will present an end-to-end power architecture built around 800 VDC for AI data centers at electronica 2026 in Munich, running November 10 to 13 across two booths under the theme "LITEON Powers AI."
LITEON covers rack-to-chip power delivery for high-density AI computing
Rising AI power density is reshaping data center power architectures and increasing the need for efficient, reliable power delivery from the rack to the chip. LITEON's architecture spans energy storage, rack-level power delivery, server power and chip-level power conversion.
The product lineup includes 800 VDC, high-power Power Shelves, modular power solutions, 800V and 50V Power Bricks, Intermediate Bus Converter (IBC) Modules and Voltage Regulator Modules (VRMs). LITEON will also show high-power magnetic components for AI power systems, energy storage and industrial power conversion.