Compal Electronics

San Jose – October 27, 2026 -- Compal Electronics (TWSE: 2324) and ARC Cloud have signed a non-binding memorandum of understanding to explore a data center development roadmap of up to 100 MW for large-scale AI computing infrastructure.

Compal and ARC Cloud sign framework MOU at 2026 OCP Global Summit

The MOU establishes a framework for collaboration across multiple projects. It aligns with ARC Cloud's plans for continued capital investment in AI infrastructure and data center development across the United States, including California, Nevada, Texas and Georgia.

The partnership extends beyond AI server supply to system engineering, technical validation, deployment coordination and ongoing support. The stated aim is to accelerate delivery of computing capacity for AI model training, fine-tuning and inference.

San Jose – October 14, 2026 -- Compal Electronics (TWSE: 2324) will show an eight-GPU, liquid-cooled NVIDIA Blackwell Ultra server alongside Rubin-based and Vera CPU systems at OCP Global Summit 2026. The company is pitching shorter time-to-AI to cloud service providers, enterprises and AI infrastructure operators.

Compal's 4U OG430-2-L1 server packs eight Blackwell Ultra GPUs

The OG430-2-L1 is a 4U direct liquid-cooled server built on the NVIDIA HGX B300 platform with eight NVIDIA Blackwell Ultra GPUs. It targets AI training, reasoning, inference and HPC workloads. Compal bundles platform engineering, liquid cooling, system validation, rack integration and manufacturing readiness to cut the engineering effort between buying new accelerators and running them in production.

San Jose – September 29, 2026 -- Compal Electronics (TWSE: 2324) will showcase megawatt-scale power and liquid-cooling infrastructure for NVIDIA accelerated computing at OCP Global Summit 2026, positioning rack-level integration as the next bottleneck for AI data centers.

Compal advances 800VDC power architecture to cut conversion losses at scale

The company is developing 800VDC power architecture and megawatt-class power infrastructure aimed at reducing power conversion complexity in next-generation AI data centers. The shift to higher-voltage DC systems targets the rising rack power density driven by accelerated computing deployments.

Riyadh – September 08, 2026 -- HUMAIN, the Saudi Public Investment Fund-backed AI company, has named Compal Electronics (TWSE: 2324) its strategic long-term ODM partner to build next-generation AI infrastructure and intelligent computing platforms.

Deal spans cloud, edge and physical AI infrastructure

The partnership establishes a roadmap covering cloud AI infrastructure, edge computing, physical AI and future intelligent computing technologies, supporting HUMAIN's push to build regional AI capacity. The two companies unveiled the collaboration at the LEAP 2026 technology event in Riyadh.

Riyadh – September 07, 2026 -- HUMAIN has named Compal Electronics (TWSE:2324) as its long-term strategic ODM partner to build AI infrastructure spanning cloud data centers to edge devices, with the deal signed and showcased at LEAP 2026 in Riyadh, Saudi Arabia.

HUMAIN and Compal sign roadmap covering AI servers, edge computing and Physical AI

Tony Bonadero, CEO of Compal Electronics, and Tareq Amin, CEO of HUMAIN, signed the strategic partnership agreement at LEAP 2026. The collaboration establishes a long-term roadmap covering cloud AI infrastructure, edge computing, Physical AI, and future intelligent computing technologies to support HUMAIN's regional AI ambitions.