San Jose – September 29, 2026 -- Compal Electronics (TWSE: 2324) will showcase megawatt-scale power and liquid-cooling infrastructure for NVIDIA accelerated computing at OCP Global Summit 2026, positioning rack-level integration as the next bottleneck for AI data centers.
Compal advances 800VDC power architecture to cut conversion losses at scale
The company is developing 800VDC power architecture and megawatt-class power infrastructure aimed at reducing power conversion complexity in next-generation AI data centers. The shift to higher-voltage DC systems targets the rising rack power density driven by accelerated computing deployments.
Liquid-cooling portfolio expands to match megawatt-scale rack density
Compal is adding advanced liquid-cooling technologies and megawatt-scale cooling capabilities to its infrastructure lineup. Rather than engineering compute, power and cooling as separate systems, the company is integrating them at the rack and data-center level.
Compal positions infrastructure strategy beyond individual server platforms
Alan Chang, Vice President of ISBG at Compal, said the company is combining power, cooling, rack integration and NVIDIA accelerated computing to help customers scale AI infrastructure from platform level to megawatt-scale deployments.
Compal will present the technologies at Booth #E65 during OCP Global Summit 2026, framing the demonstration as infrastructure engineering spanning from the power grid to the GPU.