DIGITIMES

DIGITIMES Report: AI Data Centers Shift to 800VDC Power Architecture

Taipei – October 08, 2026 -- A new DIGITIMES Intelligence report finds that rising rack-level power demands from AI computing are pushing data center operators toward 800VDC power architecture, a shift set to redraw competitive lines across the semiconductor and infrastructure supply chain.

Rack power density is turning electricity delivery into a system-level design problem

As AI accelerators and GPUs scale compute density, DIGITIMES Intelligence notes that power delivery is no longer a facility-level afterthought. Operators and server makers must now jointly optimize conversion efficiency, power density, system footprint, and thermal management across the entire path from grid to chip.

DIGITIMES Launches News Feed API, Revamps Intelligence Hub

Taipei – October 06, 2026 -- DIGITIMES has rolled out two intelligence-service upgrades aimed at enterprises tracking fast-moving shifts in the global technology supply chain, including a redesigned DIGITIMES Intelligence hub and a new DIGITIMES News Feed API that delivers licensed full-text reporting as structured enterprise data.

News Feed API turns two decades of reporting into machine-readable JSON data

The DIGITIMES News Feed API makes more than 20 years of technology supply chain reporting available in JSON format for the first time. Enterprises can scope coverage by company, technology, industry topic, or a customized Keyword Watchlist, feeding content directly into dashboards, alerting systems, internal knowledge bases, and Retrieval-Augmented Generation (RAG) pipelines. A two-week evaluation trial is offered once coverage scope is confirmed.

BYD's 20-Year Chip Bet Pays Off as China Pushes Auto Semiconductor Localization

Taipei – September 10, 2026 -- A new DIGITIMES Intelligence report finds that BYD's Xuanji A3 smart-driving system-on-chip has entered scaled production on a 4nm automotive-grade process, marking the culmination of a semiconductor strategy the company began building more than two decades ago.

BYD's chip roadmap moved from power devices to 4nm smart-driving silicon

BYD's semiconductor efforts started with IGBT and silicon carbide (SiC) power devices for electric-vehicle control systems, according to the report. That foundation has since expanded into higher-compute automotive SoCs, positioning the Xuanji A3 as a flagship product of a vertically integrated manufacturing model spanning chip design, wafer fabrication and mass production across multiple in-house fabs.