GSME Joins TSMC's OIP Value Chain Alliance in North America
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San Jose, Calif. – September 17, 2026 -- GS Microelectronics U.S., Inc. (GSME) has officially joined TSMC's Open Innovation Platform (OIP) Value Chain Alliance (VCA) as a North American member partner, expanding its role in delivering full-lifecycle ASIC services from IP development through advanced packaging and testing.
GSME expands ASIC services across the full IC value chain
The partnership integrates GSME's design enablement tools with the broader OIP Ecosystem, covering front-end architecture, back-end physical design, wafer manufacturing, advanced packaging, assembly and testing under a single execution framework.