San Jose, Calif. – September 17, 2026 -- GS Microelectronics U.S., Inc. (GSME) has officially joined TSMC's Open Innovation Platform (OIP) Value Chain Alliance (VCA) as a North American member partner, expanding its role in delivering full-lifecycle ASIC services from IP development through advanced packaging and testing.
GSME expands ASIC services across the full IC value chain
The partnership integrates GSME's design enablement tools with the broader OIP Ecosystem, covering front-end architecture, back-end physical design, wafer manufacturing, advanced packaging, assembly and testing under a single execution framework.
Company has scaled from Silicon Valley startup to six-site global operation since 2022
Founded in 2022, GSME now operates across San Jose, Phoenix, Hsinchu, Ho Chi Minh City, Danang and Muscat. The company is backed by Series B funding from Maverick Silicon and has been building out its design services, advanced packaging, IP portfolio and AI-driven supply chain tools.
GSME targets faster, lower-risk path from prototype to high-volume production
"Joining TSMC's OIP ecosystem as a VCA partner in North America underscores our commitment to delivering a unified, execution-driven platform for our customers," said Farhat Jahangir, President and CEO of GSME. He said the goal is to move customers from early multi-project wafer (MPW) exploration into high-volume production without the cost, delay and fragmentation created by coordinating multiple vendors.
Percy Chang, Director of Emerging Business Development at TSMC, said the alliance combines TSMC's process and packaging technologies with GSME's design and turnkey services to expand support for mutual customers developing silicon solutions.
GSME builds 2.5D/3D packaging capability for AI and HPC chip customers
GSME's MPW services provide an entry point for early silicon validation that converts directly into turnkey high-volume manufacturing. The company is developing 2.5D/3D advanced packaging capabilities, including support for TSMC's CoWoS-based architectures, aimed at AI and high-performance computing customers.
An agentic LLM platform built by GSME links the design, wafer, assembly and yield stages, giving customers supply chain visibility across the manufacturing process.