SUNON Unveils Chip-to-Rack Liquid Cooling Line for AI Data Centers
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Kaohsiung – September 29, 2026 -- Sunonwealth Electric Machine Industry Co., Ltd., known as SUNON, will present a full chip-to-rack liquid cooling portfolio at the OCP Global Summit 2026, running October 12-15 at the San Jose McEnery Convention Center in California.
SUNON targets rising AI chip power densities with a three-tier cooling architecture
Under the banner "Build to Chill," SUNON's booth A19 display spans chip-level, server-level, and rack-level liquid cooling technologies. The company positions the integrated stack to address a range of power densities, operating environments, and system requirements as AI accelerators push thermal loads beyond the limits of traditional air cooling.