Kaohsiung – September 29, 2026 -- Sunonwealth Electric Machine Industry Co., Ltd., known as SUNON, will present a full chip-to-rack liquid cooling portfolio at the OCP Global Summit 2026, running October 12-15 at the San Jose McEnery Convention Center in California.
SUNON targets rising AI chip power densities with a three-tier cooling architecture
Under the banner "Build to Chill," SUNON's booth A19 display spans chip-level, server-level, and rack-level liquid cooling technologies. The company positions the integrated stack to address a range of power densities, operating environments, and system requirements as AI accelerators push thermal loads beyond the limits of traditional air cooling.
Data center operators face mounting pressure to adopt liquid cooling as AI workloads scale
Thermal management has become a bottleneck for next-generation AI infrastructure as chip power densities climb. SUNON's multi-level approach is designed to let customers deploy cooling solutions matched to specific rack configurations rather than a single fixed system, aiming to improve efficiency, reliability, and deployment flexibility across mixed hardware environments.
SUNON invites OCP attendees to evaluate cooling technology ahead of broader AI infrastructure rollouts
The company will use the summit to engage directly with data center operators and hyperscale customers on thermal challenges tied to future AI system designs. Representatives will be available at booth A19 throughout the four-day event to discuss deployment scenarios for the chip, server, and rack-level cooling products on display.