GSME, Teradyne Launch Test Center for AI, Auto Chips in Q4 2026
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San Jose, Calif. – September 22, 2026 -- GS Microelectronics U.S. (GSME) and Teradyne, Inc. (NASDAQ: TER) have signed a multi-year strategic partnership to build a semiconductor test and evaluation center at GSME's new 42,000-square-foot Silicon Valley headquarters, with the facility set to open in Q4 2026.
GSME will run a dedicated Teradyne-equipped test floor for next-generation chips
The center will deploy Teradyne's latest test handlers, probers, and automated test systems to support customer demonstrations, device evaluations, engineering development, pilot production, and technical training. Target applications include AI hyperscaler devices, silicon photonics, automotive semiconductors, power management, and RF technologies.