Seoul – September 12, 2026 -- DB HiTek has completed reliability qualification for its 8-inch (200mm) 1,200V silicon carbide (SiC) MOSFET manufacturing process, establishing what the company calls the world's first complete foundry production flow for 8-inch SiC power semiconductors. Mass production is targeted for 2027.
DB HiTek builds foundry platform as industry shifts from 6-inch to 8-inch SiC wafers
SiC power semiconductors outperform conventional silicon in high-temperature, high-voltage applications, making them a preferred material for electric vehicles, renewable energy systems and industrial power equipment. While 6-inch wafers currently dominate SiC production, major global chipmakers are moving to 8-inch wafers to improve manufacturing efficiency and cost competitiveness. DB HiTek developed its 8-inch SiC processing technology and foundry capacity in response to this shift, optimizing its high-power SiC MOSFET process to secure competitive electrical parameters and reliability.
First- and second-generation design kits target over one year of development-time savings
DB HiTek is offering customers first- and second-generation process design kits (PDKs) for its proprietary 1,200V SiC MOSFET process, with a third-generation PDK scheduled for release in November. The company says the kits reduce resource requirements during early development stages, speed up prototyping and cut overall product development time by more than a year. The qualified second-generation process achieves a specific on-resistance (Rsp) of 2.5 mΩ·cm2 or less and a threshold voltage (Vth) of 3V or higher at an on-state gate voltage [Vgs(on)] of 18V.
Third-generation process targets 2.3 mΩ·cm2 resistance and 2.5-microsecond short-circuit tolerance
The third-generation process, slated for a November launch, is being qualified to reach a specific on-resistance of 2.3 mΩ·cm2 or less at the same 18V gate voltage, alongside a short-circuit withstand time (SCWT) of at least 2.5 microseconds within the short-circuit safe operating area (SCSOA). DB HiTek plans to release the corresponding PDK to customers once this qualification is finalized.
DB HiTek to open access to long-standing customers in Q3, full rollout by Q2 2027
DB HiTek intends to complete process preparations and grant access to long-standing customers in the third quarter of this year, before extending the service to all customers starting in the second quarter of 2027. A company representative said the reliability qualification confirms DB HiTek has secured the core technology and manufacturing foundation needed to offer 8-inch SiC foundry services, adding that the firm will continue preparing for 2027 mass production to strengthen its position in the next-generation power semiconductor foundry market.