Electronics Manufacturing

Hsinchu – – September 19, 2026 -- M31 Technology has entered a technology collaboration with Rambus Inc. to integrate MIPI CSI and MIPI DSI controller technologies into its silicon-proven MIPI PHY portfolio, creating a complete MIPI subsystem offering for imaging and display applications.

M31 combines Rambus controllers with its existing PHY portfolio to eliminate multi-vendor integration risk

Previously, customers sourcing M31 PHYs had to separately procure MIPI CSI/DSI controllers and manage cross-vendor integration themselves. The new collaboration lets M31 deliver both controller and PHY layers as a single validated package, cutting verification cycles and shortening time-to-market for camera and display interface designs.

Hangzhou – September 18, 2026 -- Hangzhou Zhilianhui Electronic Technology Co., Ltd. has launched a direct-to-consumer website for AccuMEMS, its thermal imaging brand, giving technicians and small businesses a new sales channel that bypasses traditional distributor markups on professional-grade inspection hardware.

AccuMEMS targets the price gap between industrial and consumer thermal cameras

The company is positioning its product line between high-end professional thermal imaging systems, which offer high-resolution sensors and rugged designs but often exceed the budgets of independent contractors, and basic consumer-grade devices with limited measurement capability. AccuMEMS is betting that a segment of electricians, HVAC technicians, building inspectors, and automotive diagnosticians will pay for mid-tier accuracy without absorbing the cost structure of specialized lab equipment.

Kyoto – September 18, 2026 -- ROHM Co., Ltd. has developed the RS4P063BPHZG, a 100V MOSFET delivering approximately five times the Safe Operating Area (SOA) tolerance of standard equivalent-sized products under VDS=100V and PW=100 microseconds.

New MOSFET targets automotive safety and protection circuits

The RS4P063BPHZG is optimized for airbag inflator ignition circuits, seat belt pretensioner drive circuits, and pyro-fuse drive circuits for battery cutoff. ROHM engineered the device to effectively suppress secondary breakdown, achieving Wide-SOA performance across a broad voltage range while housed in the standard HPLF5060 (5060-size) package widely used across automotive applications.

Sydney – September 18, 2026 -- Silicon Quantum Computing (SQC) has appointed semiconductor finance veteran John Hollister as Chief Financial Officer, effective August 17, 2026, as the Sydney-based quantum computing manufacturer scales its commercial roadmap.

Hollister brings 25 years of semiconductor finance leadership to SQC's growth push

Hollister previously served as CFO of GlobalFoundries, one of the world's largest semiconductor foundries. He spent two decades at Silicon Labs, including 11 years as CFO, and held earlier roles at Cicada Semiconductor and Cirrus Logic. Based in the U.S., his mandate at SQC covers capital formation, financial planning, worldwide accounting, M&A, tax and investor relations.

Rockville, Md. – September 18, 2026 -- Ceva, Inc. (NASDAQ: CEVA) has appointed Ziv Hammer as Executive Vice President, Connectivity & Sensing, a newly created role that consolidates the company's connectivity and sensing businesses along with its CTO Office under a single leader.

Hammer brings two decades of semiconductor leadership from Intel, Infineon and GlobalFoundries

Hammer joins Ceva after senior roles at Intel, Infineon Technologies and GlobalFoundries, where he led global engineering organizations of more than 1,000 employees spanning compute, connectivity, IoT and semiconductor technologies. Most recently, he served as Senior Vice President, Design Platforms and Services at GlobalFoundries, working across technology, IP, design enablement and ecosystem partners to move complex customized silicon designs from concept to production.

San Jose, Calif. – September 17, 2026 -- GS Microelectronics U.S., Inc. (GSME) has officially joined TSMC's Open Innovation Platform (OIP) Value Chain Alliance (VCA) as a North American member partner, expanding its role in delivering full-lifecycle ASIC services from IP development through advanced packaging and testing.

GSME expands ASIC services across the full IC value chain

The partnership integrates GSME's design enablement tools with the broader OIP Ecosystem, covering front-end architecture, back-end physical design, wafer manufacturing, advanced packaging, assembly and testing under a single execution framework.

Amherst, Mass. – September 16, 2026 -- Myrias Optics has won the 2026 SIVA Award for "Optical Technology Breakthrough of the Year" at the China International Optoelectronic Expo, the company announced.

Judges recognize Myrias Optics' nanoimprint lithography platform for AR waveguide manufacturing

The SIVA Awards are established honors within China's virtual and augmented reality industry. The judging panel cited Myrias Optics' proprietary all-inorganic nanoimprint lithography platform for its potential to enable scalable manufacturing of high-performance AR waveguides and meta-optics.

Technology targets smartglasses, co-packaged optics, and quantum computing applications

The company positions its wafer-level optical solutions for use across consumer smartglasses, co-packaged optics, and quantum computing hardware, integrating advanced nanostructures with high-throughput manufacturing processes.

Berlin – September 16, 2026 -- OneOdio wrapped a five-day showcase at IFA 2026 in Berlin, unveiling its Studio Max 2 and A70 Gen 2 professional headphones to DJs, creators and industry buyers at Hall 8.2, Booth 217.

Studio Max 2 delivers 9ms latency and 120-hour battery life for professional use

Built on OneOdio's third-generation Rapid Wireless+ technology, Studio Max 2 targets DJs and audio professionals with ultra-low 9ms latency and up to 120 hours of battery life, aimed at studio production and live performance settings.

A70 Gen 2 extends a platform that has sold over one million units

The successor to OneOdio's A70 line adds LDAC and Hi-Res Audio support with up to 72 hours of wireless playback, combining wired and wireless modes for use cases spanning DJ practice, home studios, gaming and daily commuting.

Berlin – September 16, 2026 -- XPPen's newly unveiled Magic Pro 13 secured four "Best of IFA 2026" honors at the Berlin trade show, with recognition from Gadgety Awards, TechRadar, Yanko Design, and Android Headlines.

Magic Pro 13 draws top media honors for hardware-software integration

The drawing pad earned top recognition at IFA 2026, with media outlets citing its seamlessly integrated hardware-software ecosystem. TechRadar specifically praised the device's industry-leading hardware-level Drawing Display Mode, which delivers low latency and native color output through a single-cable connection. The feature allows artists to switch between a standalone drawing pad and a secondary display without additional setup.

Kyoto – September 16, 2026 -- ROHM Co., Ltd. has developed the SDR01 Series of high anti-surge chip resistors, achieving a rated power of 0.33W in the compact 0402 (1005 Metric) size, enabling manufacturers to replace larger-size resistors while maintaining the reliability standards required for anti-surge components.

New Resistors Guarantee 0.33W Up to 125 Degrees Celsius

The SDR01 Series guarantees 0.33W of rated power up to a terminal temperature of Tk=125 deg C, easing thermal design constraints in high-density mounting environments and areas near heat-generating components. ROHM achieved this by optimizing the resistive element and electrode designs of the chip, allowing high power handling to be certified in a smaller footprint without compromising the durability expected of anti-surge products.