Sidel to Unveil New Innovations at PACK EXPO International in Chicago
SHERIDAN, WYOMING – October 16, 2024 – Sidel, a leading global provider of packaging solutions, is set to showcase its latest innovations at PACK EXPO International in Chicago from November 3rd to 6th.
Sidel will be located at booth S-2021, where attendees can explore the company's cutting-edge technologies and sustainable packaging solutions.
Presentation Highlights