xFusion Pitches 800V HVDC and 155 kW Liquid Racks at OCP 2026
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San Jose – October 14, 2026 -- xFusion is showing a 155 kW liquid-cooled rack, cold plates rated above 4,000 watts per chip and a prototype 800V high-voltage DC power supply for up to 1.2 MW at the 2026 Open Compute Project (OCP) Global Summit, which runs October 12–15 at the San Jose McEnery Convention Center (Booth A33).
The company is targeting power density, which it describes as the main constraint on AI data center scaling. Single-chip power consumption is trending toward 3,000 watts and beyond, while rack-level density is moving from hundreds of kilowatts toward the megawatt class.