San Jose – October 14, 2026 -- xFusion is showing a 155 kW liquid-cooled rack, cold plates rated above 4,000 watts per chip and a prototype 800V high-voltage DC power supply for up to 1.2 MW at the 2026 Open Compute Project (OCP) Global Summit, which runs October 12–15 at the San Jose McEnery Convention Center (Booth A33).
The company is targeting power density, which it describes as the main constraint on AI data center scaling. Single-chip power consumption is trending toward 3,000 watts and beyond, while rack-level density is moving from hundreds of kilowatts toward the megawatt class.
xFusion's keynote ties data center value to energy conversion
Arthur Wang, Director of Product Management at xFusion, used his keynote, "Next-Generation Power & Cooling Solutions," to introduce a measurement framework: WATT → FLOPS → TOKEN → AGENT → VALUE. It judges a facility by how efficiently each watt becomes business outcomes, rather than by servers shipped or cards installed. Wang said competitiveness in the agentic era depends on the value extracted "from every watt and every joule of heat."
Cold plates with diamond-copper composites exceed 4,000 watts per chip
xFusion argues that 100% direct liquid cooling (DLC) is becoming the baseline because chip heat density now exceeds what air can manage. Its cold plates use diamond-copper composite materials and deliver single-chip cooling capacity above 4,000 watts.
FusionPod for AI V8 is a 42U modular liquid-cooled rack supporting up to 155 kW. It is designed for retrofit and containerized deployments, and its distributed CDU requires no secondary piping modifications.
800V HVDC Sidecar targets 300 kW to 1.2 MW configurations
xFusion says traditional 54V DC distribution suffers severe efficiency losses at megawatt scale. The 800V architecture reduces current and line losses. The company's 800V HVDC Sidecar is a prototype engineered for 300 kW to 1.2 MW configurations and is meant as groundwork for megawatt-class rack-level power delivery.
DaYu 2.0 Super Node packs 256 XPUs across dual cabinets
On interconnect, xFusion points to electrical signaling approaching its physical limits beyond 224G and to a shift toward optical links, including co-packaged optics (CPO). The DaYu 2.0 Super Node is an open-architecture, liquid-cooled system delivering up to 240 kW per rack. It holds 128 XPUs per cabinet and 256 across dual cabinets, and it supports multi-vendor processors without single-chip lock-in.
xFusion calls the combined approach "computing-power synergy," optimizing energy flow from the grid to the chip. The company reports membership in more than 60 industry organizations, contributions to over 60 industry standards and an ecosystem of over 30,000 partners.