Power Infrastructure

San Jose – October 14, 2026 -- xFusion is showing a 155 kW liquid-cooled rack, cold plates rated above 4,000 watts per chip and a prototype 800V high-voltage DC power supply for up to 1.2 MW at the 2026 Open Compute Project (OCP) Global Summit, which runs October 12–15 at the San Jose McEnery Convention Center (Booth A33).

The company is targeting power density, which it describes as the main constraint on AI data center scaling. Single-chip power consumption is trending toward 3,000 watts and beyond, while rack-level density is moving from hundreds of kilowatts toward the megawatt class.

Austin – October 14, 2026 -- Flex (NASDAQ: FLEX) has completed its acquisition of EPC Power, adding a power conversion provider with more than 15 GW deployed to its Cloud and Power Infrastructure segment weeks before shareholders weigh the planned spin-off of that unit.

EPC Power joins Flex's Cloud and Power Infrastructure segment

EPC Power supplies intelligent power conversion solutions for data center and grid applications. Flex said the acquisition expands its capabilities across power, cooling and compute as demand grows for higher-density AI infrastructure and next-generation 800V data center power architectures.

Flex did not disclose the purchase price or other financial terms.

Taipei – October 07, 2026 -- A new DIGITIMES Intelligence report finds that rising rack-level power demands from AI computing are pushing data center operators toward 800VDC power architecture, a shift set to redraw competitive lines across the semiconductor and infrastructure supply chain.

Rack power density is turning electricity delivery into a system-level design problem

As AI accelerators and GPUs scale compute density, DIGITIMES Intelligence notes that power delivery is no longer a facility-level afterthought. Operators and server makers must now jointly optimize conversion efficiency, power density, system footprint, and thermal management across the entire path from grid to chip.