Samsung Electronics

Shenzhen – November 04, 2026 -- Samsung Display will transfer its 10.16% stake in TCL China Star Optoelectronics Technology (TCL CSOT) to its parent, Samsung Electronics, making the consumer electronics group a direct shareholder in the display panel maker. TCL Technology and Samsung Electronics jointly announced the move after market close on October 30.

TCL Technology keeps its 82.82% controlling stake in TCL CSOT

The transfer does not change control of TCL CSOT. TCL Technology continues to hold 82.82% of the company. Samsung Electronics will hold 10.16% once the transaction completes.

SEOUL – October 31, 2026 -- NIDS Co., Ltd., a South Korean environmental sensor maker that says it has supplied more than 10 million sensors cumulatively, has confirmed it will exhibit at CES 2027 to convert product introductions into overseas supply contracts.

The company is targeting global home appliance makers, HVAC specialists and robotics companies. Its customer base already includes Dyson, Samsung Electronics and Hyundai Motor.

NIDS Claims 5 Million Units of Annual Mass-Production Capacity

NIDS designs the core air quality measurement components in-house and says it has a system in place to mass-produce 5 million units a year. Its portfolio covers particulate matter sensors measuring PM1.0, PM2.5 and PM10, and non-dispersive infrared (NDIR) optical gas sensors for carbon dioxide and carbon monoxide. It also sells composite environmental sensors and electronic nose modules that detect odors, gas leaks and fires.

London – October 19, 2026 -- The global 3D through-silicon-via (TSV) and 2.5D packaging market will grow from USD 9.46 billion in 2025 to USD 21.50 billion by 2035, according to Credence Research. That implies a compound annual growth rate of 8.50% for 2026-2035. The figures are the firm's proprietary model estimates, not audited supplier sales totals.

HBM and data centers account for the largest share of spending

High-bandwidth memory (HBM) and other memory made up 46.0% of 2025 application revenue. Data centers and high-performance computing held 55.0% of end-use spending. By technology, 2.5D integration led with 38.0% of 2025 value, and die-to-wafer integration accounted for 48.0%.

Shenzhen – October 19, 2026 -- More than half of cloud data center capital expenditure is expected to go to memory and storage, excluding HBM, by 2027, according to a projection by Morgan Stanley's Daniel Yen presented at the 5th GMIF Innovation Summit. The forum, themed "The Future Built on AI Memory and Storage," was co-hosted by the Shenzhen Memory Industry Association (SMIA) and Peking University's School of Integrated Circuits at the Renaissance Shenzhen Bay Hotel.

Yen said global data center capex will stay strong in the coming years. He named six paths to overcome the "memory wall": process migration, design changes, advanced packaging, memory peripherals, PIM/CIM and new materials.

New York – October 08, 2026 -- Samsung Wallet and Samsung Pay will support stablecoin transfers on Solana, letting U.S. Galaxy users send cross-border payments in USDC starting the last week of October 2026, the Solana Foundation announced.

Feature launches across 82 million U.S. Galaxy devices

The remittance tool is embedded directly into Samsung Wallet, the same interface users already use for cards, boarding passes and IDs. Integrated fiat on- and off-ramps will convert funds to and from local currency, with Solana's infrastructure running in the background. Additional international markets will follow, subject to local regulatory approval.

Pune, India – October 07, 2026 -- The global smart refrigerator market will climb from USD 5.28 billion in 2025 to USD 14.30 billion by 2034, expanding at a compound annual growth rate of 11.7% between 2026 and 2034, according to a new analysis by Maximize Market Research.

North America leads while Asia Pacific posts fastest growth

North America holds the top regional position, driven by high smart-home penetration, strong consumer purchasing power, and established retail and e-commerce networks for connected appliances. Asia Pacific is projected to grow fastest as urbanization, rising incomes, and expanding middle-class populations accelerate smart appliance adoption across China, Japan, South Korea, and India. Europe is advancing on strict energy-efficiency regulations, while the Middle East & Africa market is expanding through premium residential and hospitality construction.

Shenzhen – September 27, 2026 -- Memory and storage executives from Samsung, Sandisk, Solidigm, Arm and Lenovo converged in Shenzhen on September 23 to argue that AI inference workloads, not training alone, are now the primary driver reshaping storage architecture demand. The 5th GMIF2026 Innovation Summit, co-hosted by the Shenzhen Memory Industry Association (SMIA) and Peking University's School of Integrated Circuits, drew IDMs, controller makers, OSATs, and AI infrastructure vendors under the theme "The Future Built on AI Memory and Storage."